MAS9178A1TB00.01 MAS [Micro Analog systems], MAS9178A1TB00.01 Datasheet - Page 2

• Manufacturer Part Number: MAS9178A1TB00.01
• Description: AM Receiver IC
• Manufacturer: MAS [Micro Analog systems]

PAD LAYOUT
Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or
left floating. Please make sure that VDD is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Coordinates are pad center points where origin has been located in the center of VDD pad
Pad Identification
Power Supply Voltage
Quartz Filter Output for Crystal
Quartz Filter Input for Crystal and
External Compensation Capacitor
Quartz Filter Output for External
Compensation Capacitor
AGC Capacitor
Receiver Output
Demodulator Capacitor
AGC On Control
Power Down Input
Positive Receiver Input
Negative Receiver Input
Power Supply Ground
Notes:
1) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced
2) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working)
3) PDN = VSS means receiver on; PDN = VDD means receiver off
(modulated)
-
-
-
-
the output is a current source/sink with |I
at power down the output is pulled to VSS (pull down switch)
Internal pull-up with current < 1 µA which is switched off at power down
Fast start-up is triggered when the receiver is after power down (PDN=VDD) controlled to power up
(PDN=VSS) i.e. at the falling edge of PDN signal.
DIE size = 1.91 x 1.78 mm; PAD size = 100 x 100 µm except for VSS PAD size 104 x 112 µm
VSS RFM RFP PDN AON
VDD QOP QI QOM AGC
1906 µm
9178
A1
Name
QOM
QOP
VDD
AGC
OUT
DEC
AON
PDN
RFM
RFP
VSS
OUT
QI
| > 5 µA
X-coordinate
1146 µm
1389 µm
1389 µm
1146 µm
OUT
306 µm
549 µm
866 µm
829 µm
586 µm
269 µm
DEC
16 µm
0 µm
1778 µm
Y-coordinate
1428 µm
1428 µm
1428 µm
1428 µm
1428 µm
1407 µm
19 µm
19 µm
19 µm
19 µm
19 µm
0 µm
10 Dec, 2003
DA9178.001
Note
1
2
3
2 (8)