HSMS-8101 HP [Agilent(Hewlett-Packard)], HSMS-8101 Datasheet - Page 4

• Manufacturer Part Number: HSMS-8101
• Description: Surface Mount Microwave Schottky Mixer Diodes
• Manufacturer: HP [Agilent(Hewlett-Packard)]

PACKAGE
MARKING
CODE (XX)
CODE (XX)
Package Characteristics
Lead Material ...................................................................................... Alloy 42
Lead Finish ............................................................................ Tin-Lead 85-15%
Maximum Soldering Temperature .............................. 260°C for 5 seconds
Minimum Lead Strength .......................................................... 2 pounds pull
Typical Package Inductance .................................................................. 2 nH
Typical Package Capacitance .............................. 0.08 pF (opposite leads)
Package Dimensions
Outline 23 (SOT-23)
Outline 143 (SOT-143)
MARKING
PACKAGE
0.60 (0.024)
0.45 (0.018)
1.02 (0.040)
0.89 (0.035)
0.013 (0.0005)
0.10 (0.004)
2
4
DIMENSIONS ARE IN MILLIMETERS (INCHES)
2.04 (0.080)
1.78 (0.070)
3.06 (0.120)
2.80 (0.110)
0.60 (0.024)
0.45 (0.018)
X X X
1
TOP VIEW
2.04 (0.080)
1.78 (0.070)
3.06 (0.120)
2.80 (0.110)
3
SIDE VIEW
X X X
1
DIMENSIONS ARE IN MILLIMETERS (INCHES)
3
2
0.54 (0.021)
0.37 (0.015)
0.013 (0.0005)
0.10 (0.004)
1.40 (0.055)
1.20 (0.047)
0.92 (0.036)
0.78 (0.031)
0.54 (0.021)
0.37 (0.015)
1.04 (0.041)
0.85 (0.033)
DATE CODE (X)
1.40 (0.055)
1.20 (0.047)
1.02 (0.041)
0.85 (0.033)
DATE CODE (X)
0.15 (0.006)
0.09 (0.003)
2.65 (0.104)
2.10 (0.083)
0.152 (0.006)
0.066 (0.003)
2.65 (0.104)
2.10 (0.083)
0.69 (0.027)
0.45 (0.018)
END VIEW
0.69 (0.027)
0.45 (0.018)