K6R1008V1C SAMSUNG [Samsung semiconductor], K6R1008V1C Datasheet

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K6R1008V1C

Manufacturer Part Number
K6R1008V1C
Description
128Kx8 Bit High-Speed CMOS Static RAM(3.3V Operating).
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet

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K6R1008V1C-C/C-L, K6R1008V1C-I/C-P
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
Revision History
Document Title
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
128Kx8 Bit High-Speed CMOS Static RAM(3.3V Operating).
Operated at Commercial and Industrial Temperature Ranges.
Rev. No.
Rev. 0.0
Rev. 1.0
Rev. 2.0
Rev. 3.0
Rev. 3.1
Rev. 4.0
History
Initial release with Preliminary.
Relax DC characteristics.
Release to Final Data Sheet.
2.1. Delete Preliminary.
2.2. Changed Standby Current.
2.3. Added Data Retention Characteristics.
Add 10ns part.
V
Delete 20ns speed bin
IH
/V
Standby Current(Isb1)
IL
Item
I
V
V
CC
Change
IH
IL
Item
Item
-0.5
Min
12ns
15ns
20ns
2.0
Previous
V
CC
Max
0.8
+0.5
Previous
Previous
70mA
68mA
65mA
0.3mA
- 1 -
-0.3
Min
2.0
Changed
Changed
75mA
73mA
70mA
Changed
0.5mA
V
CC
Max
0.8
+0.3
Aug. 5. 1998
Sep. 7. 1998
Mar. 3. 1999
Apr. 24. 2000
Oct. 2. 2000
Sep. 24. 2001
Draft Data
CMOS SRAM
PRELIMINARY
PRELIMINARY
September 2001
Preliminary
Preliminary
Final
Final
Final
Final
Remark
Revision 4.0
P

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K6R1008V1C Summary of contents

Page 1

... K6R1008V1C-C/C-L, K6R1008V1C-I/C-P Document Title 128Kx8 Bit High-Speed CMOS Static RAM(3.3V Operating). Operated at Commercial and Industrial Temperature Ranges. Revision History Rev. No. History Rev. 0.0 Initial release with Preliminary. Rev. 1.0 Relax DC characteristics. Item I 12ns CC 15ns 20ns Rev. 2.0 Release to Final Data Sheet. 2.1. Delete Preliminary. 2.2. Changed Standby Current. ...

Page 2

... The K6R1008V1C is a 1,048,576-bit high-speed Static Random Access Memory organized as 131,072 words by 8 bits. The K6R1008V1C uses 8 common input and output lines and has an output enable pin which operates faster than address access time at read cycle. The device is fabricated using SAM- SUNG s advanced CMOS process and designed for high- speed circuit technology ...

Page 3

... K6R1008V1C-C/C-L, K6R1008V1C-I/C-P ABSOLUTE MAXIMUM RATINGS* Parameter Voltage on Any Pin Relative Voltage on V Supply Relative Power Dissipation Storage Temperature Operating Temperature Commercial Industrial * Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied ...

Page 4

... K6R1008V1C-C/C-L, K6R1008V1C-I/C-P AC CHARACTERISTICS ( TEST CONDITIONS* Parameter Input Pulse Levels Input Rise and Fall Times Input and Output timing Reference Levels Output Loads * bove test conditions are also applied at industrial temperature range. The a Output Loads(A) D OUT Capacitive Load consists of all components of the test environment ...

Page 5

... K6R1008V1C-C/C-L, K6R1008V1C-I/C-P WRITE CYCLE* Parameter Symbol Write Cycle Time t WC Chip Select to End of Write t CW Address Set-up Time t Address Valid to End of Write t AW Write Pulse Width(OE High Write Pulse Width(OE Low) t WP1 Write Recovery Time t WR Write to Output High-Z t WHZ ...

Page 6

... K6R1008V1C-C/C-L, K6R1008V1C-I/C-P NOTES(READ CYCLE high for read cycle. 2. All read cycle timing is referenced from the last valid address to the first transition address and t are defined as the time at which the outputs achieve the open circuit condition and are not referenced to V ...

Page 7

... K6R1008V1C-C/C-L, K6R1008V1C-I/C-P TIMING WAVEFORM OF WRITE CYCLE(3) Address CS WE High-Z Data in High-Z Data out NOTES(WRITE CYCLE) 1. All write cycle timing is referenced from the last valid address to the first transition address write occurs during the overlap of a low CS and WE. A write begins at the latest transition CS going low and WE going low ; ...

Page 8

... K6R1008V1C-C/C-L, K6R1008V1C-I/C-P DATA RETENTION CHARACTERISTICS* Parameter Symbol V for Data Retention CC Data Retention Current Data Retention Set-Up Time Recovery Time * The above parameters are also guaranteed at industrial temperature range. Data Retention Characteristic is for L-ver only. DATA RETENTION WAVE FORM CS controlled ...

Page 9

... K6R1008V1C-C/C-L, K6R1008V1C-I/C-P PACKAGE DIMENSIONS 32-SOJ-400 #32 11.18 0.12 0.440 0.005 #1 +0.10 0.43 -0.05 0. +0.004 0.017 0.0375 -0.002 32-TSOP2-400CF #32 #1 21.35 0.841 20.95 0.825 0.95 0. 0.10 0.037 0.016 0.004 #17 #16 21.36 MAX 0.841 20.95 0.12 0.825 0.005 1.30 ( 0.051 1.30 ( 0.051 +0.10 0.71 -0.05 1.27 +0.004 0.028 0.050 -0.002 #17 11.76 0.20 0.463 0.008 #16 MAX 0.10 0.004 1.00 0.10 0.039 0.047 0.004 1.27 0.05 MIN 0.050 0.002 - 9 - PRELIMINARY PRELIMINARY ...

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