W2465 WINBOND [Winbond], W2465 Datasheet - Page 10

• Manufacturer Part Number: W2465
• Description: 8K X 8 CMOS STATIC RAM
• Manufacturer: WINBOND [Winbond]

Package Dimensions, continued
28-pin SO Wide Body
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
Note: All data and specifications are subject to change without notice.
S
Seating Plane
28
1
e
D
b
y
15
14
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
A A
A
E
2
1
H
E
See Detail F
- 10 -
e
1
L
Detail F
e
1
L
c
E
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: [phone]
FAX: [phone]
Notes:
Symbol
3. Dimension D & E include mold mismatch
4. Controlling dimension: Inches.
5. General appearance spec should be based
1. Dimension D Max. & S include mold flash
2. Dimension b does not include dambar
A
A
A
b
c
D
E
H
L
L
S
y
and determined at the mold parting line.
on final visual inspection spec.
e
or tie bar burrs.
protrusion/intrusion.
1
2
E
E
Dimension in Inches
0.004
0.093
0.014
0.008
0.326
0.044
0.453
0.028
0.059
Min. Nom. Max.
0
0.010
0.098
0.016
0.713
0.331
0.050
0.465
0.036
0.067
0.103
0.020
0.014
0.733
0.336
0.056
0.477
0.044
0.075
0.047
.
0.112
0.004
10
11.51
0.10
2.36
0.36
0.20
8.28
1.12
0.71
Min.
1.50
0
Dimension in mm
Nom.
18.11
11.81
2.49
0.41
0.25
8.41
1.27
0.91
1.70
W2465
18.62
12.12
Max.
2.85
2.62
0.51
0.36
1.42
1.12
1.91
8.53
1.19
0.10
10