LA73B-1-HXG-PF LIGITEK [LIGITEK electronics co., ltd.], LA73B-1-HXG-PF Datasheet - Page 6

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LA73B-1-HXG-PF

Manufacturer Part Number
LA73B-1-HXG-PF
Description
LED ARRAY
Manufacturer
LIGITEK [LIGITEK electronics co., ltd.]
Datasheet
PART NO.
1.Iron:
Soldering Condition(Pb-Free)
Note: 1.Wave solder should not be made more than one time.
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
Ramp-Down:-5° C/sec(max)
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to case)
2° C/sec(max)
Solder Bath:260° C Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to case)
Soldering Iron:30W Max
2.You can just only select one of the soldering conditions as above.
Temp(°C)
LA73B-1/HXG-PF
260°
120°
25°
0
60 Seconds Max
Preheat
max
2° /sec
50
LIGITEK ELECTRONICS CO.,LTD.
260° C3sec Max
Property of Ligitek Only
5° /sec
max
100
Time(sec)
150
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