HCTS74K INTERSIL [Intersil Corporation], HCTS74K Datasheet - Page 9

• Manufacturer Part Number: HCTS74K
• Description: Radiation Hardened Dual-D Flip-Flop with Set and Reset
• Manufacturer: INTERSIL [Intersil Corporation]

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
89 x 88 mils
2.25 x 2.24mm
Type: SiAl
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCTS74 is TA14438A.
CP1 (3)
Q1 (5)
Q1 (6)
S1 (4)
5
2
NC
A/cm
Å
2
2.6k
Å
Å
1k
Å
D1
(2)
GND
(7)
HCTS74MS
HCTS74MS
R1
(1)
468
(8)
Q2
(9)
Q2
VCC
(14)
Spec Number
(13) R2
(12) D2
NC
(11) CP2
(10) S2
518626