HCTS574HMSR INTERSIL [Intersil Corporation], HCTS574HMSR Datasheet - Page 3
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HCTS574HMSR
Manufacturer Part Number
HCTS574HMSR
Description
Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.HCTS574HMSR.pdf
(11 pages)
Absolute Maximum Ratings
Supply Voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VCC +0.5V
DC Input Current, Any One Input
DC Drain Current, Any One Output
(All Voltage Reference to the VSS Terminal)
Storage Temperature Range (TSTG) . . . . . . . . . . . -65
Lead Temperature (Soldering 10sec) . . . . . . . . . . . . . . . . . . +265
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . +175
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
CAUTION: As with all semiconductors, stress listed under “Absolute Maximum Ratings” may be applied to devices (one at a time) without resulting in permanent
damage. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The conditions listed
under “Electrical Performance Characteristics” are the only conditions recommended for satisfactory device operation.
Operating Conditions
Supply Voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Rise and Fall Times at 4.5V VCC(TR, TF) . . . . . . . . . . . 500ns Max.
Operating Temperature Range (T
NOTES:
1. All voltages reference to device GND.
2. For functional tests VO
Quiescent Current
Output Current
(Sink)
Output Current
(Source)
Output Voltage Low
Output Voltage High
Input Leakage
Current
Three-State Output
Leakage Current
Noise Immunity
Functional Test
PARAMETER
SYMBOL
VOH
VOL
IOH
ICC
IOL
IOZ
IIN
FN
4.0V is recognized as a logic “1”, and VO
A
) . . . . . . . . . . . . -55
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
VCC = 5.5V,
VIN = VCC or GND
VCC = 4.5V, VIH = 4.5V,
VOUT = 0.4V, VIL = 0V
VCC = 4.5V, VIH = 4.5V,
VOUT = VCC -0.4V,
VIL = 0V
VCC = 4.5V, VIH = 2.25V,
IOL = 50 A, VIL = 0.8V
VCC = 5.5V, VIH = 2.75V,
IOL = 50 A, VIL = 0.8V
IOH = 50 A, VIL = 0.8V
VCC = 5.5V, VIH = 2.75V,
IOH = 50 A, VIL = 0.8V
VCC = 5.5V, VIN = VCC or
GND
Applied Voltage = 0V or
VCC, VCC = 5.5V
VCC = 4.5V, VIH = 2.25V,
VIL = 0.8V (Note 2)
VCC = 4.5V, VIH = 2.25V,
CONDITIONS
Specifications HCTS574MS
(NOTE 1)
o
o
C to +150
C to +125
10mA
25mA
o
o
o
o
C
C
C
C
696
GROUPS
7, 8A, 8B
GROUP
A SUB-
Reliability Information
Thermal Resistance
Maximum Package Power Dissipation at +125
If device power exceeds package dissipation capability, provide heat
sinking or derate linearly at the following rate:
Input Low Voltage (VIL). . . . . . . . . . . . . . . . . . . . . . . . . 0.0V to 0.8V
Input High Voltage (VIH) . . . . . . . . . . . . . . . . . . . . . . .VCC/2 to VCC
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
2, 3
2, 3
2, 3
2, 3
2, 3
0.5V is recognized as a logic “0”.
SBDIP Package. . . . . . . . . . . . . . . . . . . .
Ceramic Flatpack Package . . . . . . . . . . .
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.69W
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.47W
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.9mW/
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . 9.3mW/
1
1
1
1
1
+25
+25
+25
+25
+25
TEMPERATURE
+125
+125
+125
o
o
o
o
+125
+125
o
C, +125
C, +125
C, +125
C, +125
C, +125
+25
+25
+25
+25
+25
o
o
o
o
o
C, -55
C, -55
C, -55
C, -55
C, -55
o
o
o
o
o
o
o
o
o
o
C
C
C
C
C
C, -55
C, -55
C, -55
C, -55
C, -55
o
o
o
o
o
C
C
C
C
C
o
o
o
o
o
C
C
C
C
C
VCC
VCC
MIN
-7.2
-6.0
-0.1
-0.1
7.2
6.0
Spec Number
-
-
-
-
-
-
-
-
-
LIMITS
107
o
72
C Ambient
o
o
MAX
JA
C/W
750
C/W
0.1
0.1
40
0.5
5.0
50
-
-
-
-
-
-
-
1
24
28
UNITS
518629
mA
mA
mA
mA
o
o
V
V
V
V
JC
C/W
C/W
-
A
A
A
A
A
A
o
o
C
C