HCTS390DMSR INTERSIL [Intersil Corporation], HCTS390DMSR Datasheet

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HCTS390DMSR

Manufacturer Part Number
HCTS390DMSR
Description
Radiation Hardened Dual Decade Ripple Counter
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
September 1995
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
Features
• 3 Micron Radiation Hardened CMOS SOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm
• Single Event Upset (SEU) Immunity < 2 x 10
• Dose Rate Survivability: >1 x 10
• Dose Rate Upset >10
• Latch-Up Free Under Any Conditions
• Military Temperature Range: -55
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range: 4.5V to 5.5V
• LSTTL Input Compatibility
• Input Current Levels Ii
Description
The Intersil HCTS390MS is a Radiation Hardened dual
decade ripple counter.
The HCTS390MS utilizes advanced CMOS/SOS technology
to achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family .
The HCTS390MS is supplied in a 16 lead Ceramic flatpack
(K suffix) or a SBDIP Package (D suffix).
Ordering Information
HCTS390DMSR
HCTS390KMSR
HCTS390D/Sample
HCTS390K/Sample
HCTS390HMSR
Bit-Day (Typ)
- VIL = 0.8V Max
- VIH = 2.0V Min
PART NUMBER
10
RAD (Si)/s 20ns Pulse
5 A at VOL, VOH
TEMPERATURE RANGE
12
o
C to +125
-55
-55
RAD (Si)/s
o
o
C to +125
C to +125
+25
+25
+25
o
o
o
o
C
C
C
C
2
/mg
-9
o
o
C
C
Errors/
662
Pinouts
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
Sample
Die
HCTS390MS
CP0N 1
CP1N 1
MR 1
GND
Q0 1
Q1 1
Q2 1
Q3 1
SCREENING LEVEL
FLATPACK PACKAGE (FLATPACK)
16 LEAD CERAMIC DUAL-IN-LINE
CP0N 1
CP1N 1
16 LEAD CERAMIC METAL SEAL
METAL SEAL PACKAGE (SBDIP)
Dual Decade Ripple Counter
MR 1
Q0 1
Q1 1
Q2 1
Q3 1
GND
MIL-STD-1835 CDFP4-F16
MIL-STD-1835 CDIP2-T16
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
TOP VIEW
TOP VIEW
Radiation Hardened
16 Lead SBDIP
16 Lead Ceramic Flatpack
16 Lead SBDIP
16 Lead Ceramic Flatpack
Die
16
15
14
13
12
11
10
9
16
15
14
13
12
11
10
Spec Number
9
File Number
PACKAGE
VCC
CP0N 2
MR 2
Q0 2
CP1N 2
Q1 2
Q2 2
Q3 2
VCC
CP0N 2
MR 2
Q0 2
CP1N 2
Q1 2
Q2 2
Q3 2
518634
2476.2

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HCTS390DMSR Summary of contents

Page 1

... CMOS/SOS Logic Family . The HCTS390MS is supplied lead Ceramic flatpack (K suffi SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCTS390DMSR HCTS390KMSR HCTS390D/Sample HCTS390K/Sample HCTS390HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. ...

Page 2

Functional Diagram 4(12) nCP1 1(15) nCP0 2(14) nMR H = High Level L = Low Logic Level X = Immaterial HCTS390MS 3(13) 5(11) 6(10) nQ0 nQ1 nQ2 TRUTH TABLE INPUTS CP MR ACTION L ...

Page 3

Absolute Maximum Ratings Supply Voltage (VCC -0.5 to +7.0V Input Voltage Range, All Inputs . ...

Page 4

TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL CP0N to Q0n TPHL VCC = 4.5V TPLH CP1Nn to Q1n TPHL VCC = 4.5V TPLH CP1Nn to Q2n TPHL VCC = 4.5V TPLH CP1Nn to Q3n TPHL VCC = 4.5V TPLH ...

Page 5

TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Quiescent Current ICC VCC = 5.5V, VIN = VCC or GND Output Current (Sink) IOL VCC = 4.5V, VIN = VCC or GND, VOUT = 0.4V Output Current IOH VCC ...

Page 6

CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTE: 1. Alternate Group A in accordance ...

Page 7

Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...

Page 8

AC Timing Diagrams TR TF INPUT LEVEL TPLH Q0 VS FIGURE 1. INPUT PULSE PRE-REQUISITE, PROPAGATION- DELAY, AND OUTPUT-TRANSITION TIMES TTLH VOH 80% 20% OUTPUT VOL FIGURE 3. OUTPUT TRANSITION TIME AC Load Circuit HCTS390MS INPUT ...

Page 9

Die Characteristics DIE DIMENSIONS mils 2190 m x 2190 m METALLIZATION: Type: SiAl Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 ...

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