HCTS27HMSR INTERSIL [Intersil Corporation], HCTS27HMSR Datasheet
![no-image](/images/no-image-200.jpg)
HCTS27HMSR
Related parts for HCTS27HMSR
HCTS27HMSR Summary of contents
Page 1
... HCTS27KMSR - +125 C o HCTS27D/ +25 C Sample o HCTS27K/ +25 C Sample o HCTS27HMSR +25 C CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. | http://www.intersil.com or 407-727-9207 Copyright HCTS27MS Pinouts 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL 2 /mg -9 Errors/Bit-Day 12 RAD (Si)/ +125 ...
Page 2
Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage ...
Page 3
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Input to Output TPHL VCC = 4.5V Input to Output TPLH VCC = 4.5V NOTES: 1. All voltages referenced to device GND measurements assume RL = 500 , CL = ...
Page 4
TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETER SYMBOL Noise Immunity FN VCC = 4.5V, VIH = 2.25V, VIL = 0.8V, Functional Test (Note 3) Input to Output TPHL VCC = 4.5V TPLH VCC = 4.5V NOTES: 1. ...
Page 5
CONFORMANCE GROUPS METHOD Group E Subgroup 2 5005 NOTE: 1. Except FN test which will be performed 100% Go/No-Go. TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OPEN GROUND STATIC BURN-IN I TEST CONDITIONS (Note ...
Page 6
Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
Page 7
AC Timing Diagrams VIH INPUT VS VIL TPLH VOH VS OUTPUT VOL TTLH VOH 80% 20% OUTPUT VOL AC VOLTAGE LEVELS PARAMETER HCTS VCC 4.50 VIH 3.00 VS 1.30 VIL 0 GND 0 HCTS27MS AC Load Circuit DUT TPHL CL ...
Page 8
Die Characteristics DIE DIMENSIONS mils 2.20 x 2.24mm METALLIZATION: Type: SiAl Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND ...
Page 9
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, ...