HCTS139HMSR INTERSIL [Intersil Corporation], HCTS139HMSR Datasheet
HCTS139HMSR
Related parts for HCTS139HMSR
HCTS139HMSR Summary of contents
Page 1
... SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCTS139DMSR HCTS139KMSR HCTS139D/Sample HCTS139K/Sample HCTS139HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 HCTS139MS 2-to-4 Line Decoder/Demultiplexer Pinouts 2 /mg ...
Page 2
Functional Diagram 2(14) A0 3(13) A1 1(15) E INPUTS ENABLE SELECT Logic 1 = High Logic 0 = Low X = Immaterial HCTS139MS TRUTH TABLE ...
Page 3
Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...
Page 4
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL A0 Output TPHL, VCC = 4.5V TPLH Enable to Output TPHL, VCC = 4.5V TPLH NOTES: 1. All voltages referenced to device GND measurements assume RL = 500 ...
Page 5
TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETER SYMBOL Noise Immunity FN VCC = 4.5V, VIH = 2.25V, Functional Test VIL = 0.8V, (Note 3) A0 Output TPHL, VCC = 4.5V TPLH Enable to Output TPHL, ...
Page 6
CONFORMANCE GROUPS METHOD Group E Subgroup 2 5005 NOTE: 1. Except FN test which will be performed 100% go/no-go. TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OPEN GROUND STATIC I BURN-IN TEST CONNECTIONS (Note1 ...
Page 7
Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
Page 8
AC Timing Diagrams VIH INPUT VS VIL TPLH VOH VS OUTPUT VOL TTLH VOH 80% 20% OUTPUT VOL AC VOLTAGE LEVELS PARAMETER HCTS VCC 4.50 VIH 3.00 VS 1.30 VIL 0 GND 0 All Intersil semiconductor products are manufactured, assembled ...
Page 9
Die Characteristics DIE DIMENSIONS: 2.74mm x 2.68mm 108 mils x 106 mils METALLIZATION: Type: SiAl Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm ...