HCTS04HMSR INTERSIL [Intersil Corporation], HCTS04HMSR Datasheet
![no-image](/images/no-image-200.jpg)
HCTS04HMSR
Related parts for HCTS04HMSR
HCTS04HMSR Summary of contents
Page 1
... HCTS04KMSR - +125 C Intersil Class S Equivalent o HCTS04D/ +25 C Sample Sample o HCTS04K/ +25 C Sample Sample o HCTS04HMSR +25 C Die CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. | http://www.intersil.com or 407-727-9207 Copyright HCTS04MS Pinouts 2 /mg -9 Errors/Bit-Day 12 RAD (Si)/ +125 C A1 ...
Page 2
Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage ...
Page 3
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Input to Yn TPHL VCC = 4.5V VCC = 4.5V Input to Yn TPLH VCC = 4.5V VCC = 4.5V NOTES: 1. All voltages referenced to device GND measurements assume ...
Page 4
TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETER SYMBOL Noise Immunity FN VCC = 4.5V, VIH = 2.25V, Functional Test VIL = 0.8V, (Note 3) Input to Yn TPHL VCC = 4.5V TPLH VCC = 4.5V NOTES: 1. ...
Page 5
CONFORMANCE GROUPS METHOD Group E Subgroup 2 5005 NOTE: 1. Except FN test which will be performed 100% Go/No-Go. TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OPEN GROUND STATIC BURN-IN I TEST CONDITIONS (Note ...
Page 6
Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
Page 7
AC Timing Diagrams VIH INPUT VS VIL TPLH VOH VS OUTPUT VOL TTLH VOH 80% 20% OUTPUT VOL AC VOLTAGE LEVELS PARAMETER HCTS VCC 4.50 VIH 3.00 VS 1.30 VIL 0 GND 0 HCTS04MS AC Load Circuit DUT TPHL CL ...
Page 8
Die Characteristics DIE DIMENSIONS mils 2.20mm x 2.24mm METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND ...
Page 9
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, ...