L810HW-100MF SUPERWORLD [Superworld Electronics], L810HW-100MF Datasheet - Page 8

• Manufacturer Part Number: L810HW-100MF
• Description: HIGH CURRENT MOLDED POWER INDUCTORS
• Manufacturer: SUPERWORLD [Superworld Electronics]

NOTE : Specifications subject to change without notice. Please check our website for latest information.
HIGH CURRENT MOLDED POWER INDUCTORS
11. SOLDERING AND MOUNTING :
11-1. Recommended PC Board Pattern
11-2. Soldering
11-2.1 Solder Re-flow :
11-2.2 Soldering Iron (Figure 2) :
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
250~260
230
180
150
Figure 1. Re-flow Soldering
SUPERWORLD ELECTRONICS (S) PTE LTD
4.0
Recommended temperature profiles for re-flow soldering in Figure 1.
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
Preheating
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
7.0
60~120s
10s max.
Soldering
4.0
30~60s
Natural
cooling
280
260
150
Preheating
Figure 2. Iron Soldering
Over 1min.
Soldering
L810HW SERIES
Within 3secs.
Gradual
Cooling
Natural
cooling
11.11.2008
PG. 8