TA7368PG TOSHIBA [Toshiba Semiconductor], TA7368PG Datasheet
TA7368PG
Related parts for TA7368PG
TA7368PG Summary of contents
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... TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA7368PG,TA7368FG Audio Power Amplifier The TA7368PG and TA7368FG are suitable for the audio power amplifier of portable cassette tape recorder and radio. Features • Very few external parts (only three capacitors) • Low quiescent current ...
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... Phase−compensation Small temperature coefficient and excellent frequency characteristic is needed by capacitors below. • Oscillation preventing capacitors for power amplifier output • Bypass capacitor for ripple filter • Capacitor between V and GND CC : TA7368PG / TA7368FG / and IC shown in Figure 2. f ...
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... Absolute Maximum Ratings Characteristic Supply voltage TA7368PG Power dissipation TA7368FG Operating temperature Storage temperature (Note) Derated above Ta = 25°C in the proportion of 7.2mW / °C for TA7368PG and of 3.2mW / °C for TA7368FG. Electrical Characteristics For TA7368PG (Unless otherwise specified Characteristic Symbol Quiescent current I CCQ ...
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... R = 10kΩ, BPF = 20Hz~20kHz 100Hz 0. rms — Without C RIP — — 6V 25° 2.40 0.62 4 TA7368PG/FG Min. Typ. Max. Unit — 5.5 — mA — 6.6 15 — 7.5 18 — 120 — mW 300 450 — 450 610 — — 0.3 1.0 % ...
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... RIPPLE 2 9 RIPPLE FILTER + 470µ − 7 Ω 10k PHASE PRE-GND PW-GND NF + RIPPLE 5 2 RIPPLE FILTER + 470µ − 10 Ω 10k PHASE PRE-GND PW-GND NF 5 TA7368PG/ out + − out + − 2006-04-28 ...
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... Ω ° 100Hz 1 10kHz 0.5 1kHz 0.3 0.1 0.05 0.03 3 0.003 0.01 0.03 Output Power P out ( 0.03 0.1 0 Frequency f (kHz) 6 TA7368PG/FG OUT( 0.1 0 OUT(4) 0.1 0 – Ω 1mV rms 100 2006-04-28 ...
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... Output Power P out (W) P MAX – 1kHz 1 ° 4Ω 0.8 0.6 0.4 0 Supply Volatage V CC (V) 7 TA7368PG/FG – Ta CCQ P OUT THD 10 I CCQ Ω P out : THD = 10 % THD : P out = 100mW °C OUT( 1kHz ° ...
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... By being mounted on certain PCB's, flat packages increase the heat dissipating efficiency. Data shown on the left is resulted from the measurement on the PCB recommended by TOSHIBA. (θj−Τ : Thermal resistance) 140 160 ) °C Material: Phenol resin Thickness of copper leaf: 35µm Plate thickness: 1.6mm 8 TA7368PG/FG 2006-04-28 ...
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... Package Dimensions Weight: 0.92g (typ.) TA7368PG/FG 9 2006-04-28 ...
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... Package Dimensions Weight: 0.09g (typ.) TA7368PG/FG 10 2006-04-28 ...
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... In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink installation, refer to individual technical datasheets or IC databooks. TA7368PG/FG 11 2006-04-28 ...
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... R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux 021023_D 021023_B 060106_Q 12 TA7368PG/FG 060116EBA 021023_E 2006-04-28 ...