54F245FM NSC [National Semiconductor], 54F245FM Datasheet

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54F245FM

Manufacturer Part Number
54F245FM
Description
Octal Bidirectional Transceiver with TRI-STATE Outputs
Manufacturer
NSC [National Semiconductor]
Datasheet

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C 1995 National Semiconductor Corporation
54F 74F245
Octal Bidirectional Transceiver with TRI-STATE Outputs
General Description
The ’F245 contains eight non-inverting bidirectional buffers
with TRI-STATE outputs and is intended for bus-oriented
applications Current sinking capability is 24 mA (20 mA Mil)
at the A ports and 64 mA (48 mA Mil) at the B ports The
Transmit Receive (T R) input determines the direction of
data flow through the bidirectional transceiver Transmit (ac-
tive HIGH) enables data from A ports to B ports Receive
(active LOW) enables data from B ports to A ports The
Output Enable input when HIGH disables both A and B
ports by placing them in a High Z condition
Logic Symbols
TRI-STATE is a registered trademark of National Semiconductor Corporation
Note 1 Devices also available in 13 reel Use suffix
Note 2 Military grade device with environmental and burn-in processing Use suffix
74F245PC
74F245SC (Note 1)
74F245SJ (Note 1)
74F245MSA (Note 1)
Commercial
54F245DM (Note 2)
54F245FM (Note 2)
54F245LM (Note 2)
TL F 9503
Military
e
SCX SJX and MSAX
TL F 9503 – 3
Package
N20A
J20A
M20B
M20D
MSA20
W20A
E20A
Number
Features
Y
Y
Y
Y
Y
Non-inverting buffers
Bidirectional data path
A outputs sink 24 mA (20 mA Mil)
B outputs sink 64 mA (48 mA Mil)
Guaranteed 4000V minimum ESD protection
20-Lead (0 300 Wide) Molded Dual-In-Line
20-Lead Ceramic Dual-In-Line
20-Lead (0 300 Wide) Molded Small Outline JEDEC
20-Lead (0 300 Wide) Molded Small Outline EIAJ
20-Lead Molded Shrink Small Outline EIAJ Type II
20-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier Type C
e
DMQB FMQB and LMQB
Package Description
IEEE IEC
RRD-B30M75 Printed in U S A
June 1995
TL F 9503 – 4

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54F245FM Summary of contents

Page 1

... Note 1 Devices also available in 13 reel Use suffix Note 2 Military grade device with environmental and burn-in processing Use suffix Logic Symbols TRI-STATE is a registered trademark of National Semiconductor Corporation ...

Page 2

Connection Diagrams Pin Assignment for DIP SOIC SSOP and Flatpak Unit Loading Fan Out Pin Names Description OE Output Enable Input (Active LOW Transmit Receive Input A –A Side A Inputs TRI-STATE Outputs B –B ...

Page 3

Absolute Maximum Ratings If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature b Ambient Temperature under Bias b Junction Temperature under Bias b Plastic b V Pin Potential ...

Page 4

DC Electrical Characteristics Symbol Parameter I Output Short-Circuit Current OS I Bus Drainage Test ZZ I Power Supply Current CCH I Power Supply Current CCL I Power Supply Current CCZ AC Electrical Characteristics Symbol Parameter Min t Propagation Delay 2 ...

Page 5

Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) 20-Lead Ceramic Dual-In-Line Package (D) NS Package Number E20A NS Package Number J20A 5 ...

Page 6

Physical Dimensions inches (millimeters) (Continued) 20-Lead (0 300 Wide) Molded Small Outline Package JEDEC (S) 20-Lead (0 300 Wide) Molded Small Outline Package EIAJ (SJ) NS Package Number M20B NS Package Number M20D 6 ...

Page 7

Physical Dimensions inches (millimeters) (Continued) 20-Lead Molded Shrink Small Outline Package EIAJ Type II (MSA) 20-Lead Molded (0 300 Wide) Dual-In-Line Package (P) NS Package Number MSA20 NS Package Number N20A 7 ...

Page 8

Physical Dimensions inches (millimeters) (Continued) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 ...

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