S72NS-N SPANSION [SPANSION], S72NS-N Datasheet - Page 14

• Manufacturer Part Number: S72NS-N
• Description: Based MCPs
• Manufacturer: SPANSION [SPANSION]

5.3
12
MTA133—133-ball Fine-Pitch Ball Grid Array (FBGA)
10.0 x 11.0 x 1.0 mm MCP Package
PACKAGE
JEDEC
D X E
SYMBOL
SE SD
Ø b
MD
ME
A1
A2
D1
E1
eE
eD
A
D
E
n
N
R
CORNER
A
PIN A1
0.10
(2X)
A2
0.20
0.91
0.25
MIN
7L ~ 7D, 8L ~ 8D, 9L ~ 9D,
---
4L ~ 4E, 5L ~ 5D, 6L ~ 6D,
11.00 mm x 10.00 mm
10L ~ 10D, 11L ~ 11D
133X
C
11.00 BSC.
10.00 BSC.
PACKAGE
6.50 BSC.
6.50 BSC.
0.50 BSC.
0.25 BSC.
0.15
0.08
0.50 BSC
A1
MTA 133
NOM
0.30
N/A
133
133
6
14
14
---
---
---
2
b
M
M C
INDEX MARK
C A B
MAX
1.30
1.06
0.35
9
---
SIDE VIEW
TOP VIEW
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
MAXIMUM NUMBER OF BALLS
NUMBER OF LAND PERIMETERS
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALL
A d v a n c e
S72NS-N Based MCPs
NOTE
C
A
0.10
(2X)
E
B
I n f o r m a t i o n
C
0.10
0.08
eE
C
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
eD
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION
3.0, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
DATUM C IS THE SEATING PLANE AND IS DEFINED BY THE
CROWNS OF THE SOLDER BALLS.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
14
13 12
BOTTOM VIEW
11
10
9
S72NS128_256ND0_00_B1 November 9, 2005
D1
8
7
6 5
SD
4
3
2
1
7
B
D
E
F
G
H
J
K
L
M
N
P
A
C
SE
CORNER
PIN A1
7
3529 / 16.038 / 11.08.05
E1