MAAPGM0073-DIE MACOM [Tyco Electronics], MAAPGM0073-DIE Datasheet - Page 9

• Manufacturer Part Number: MAAPGM0073-DIE
• Description: Amplifier, Power, 1.2W 4.0-8.5 GHz
• Manufacturer: MACOM [Tyco Electronics]

9
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Power, 1.2W
4.0-8.5 GHz
Assembly and Bonding Diagram
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
RF
V
GG
IN
Figure 28. Recommended operational configuration. Wire bond as
150 Ω
0.1 μF
100 pF
GG
before applying positive bias to V
100 pF
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0.1 μF
V
DD
DD
MAAPGM0073-DIE
to prevent
RF
OUT
Preliminary Datasheet
903275 A