MAAPGM0070 MACOM [Tyco Electronics], MAAPGM0070 Datasheet - Page 8

• Manufacturer Part Number: MAAPGM0070
• Description: Amplifier, Power, 1.9W 10.0-13.25 GHz
• Manufacturer: MACOM [Tyco Electronics]

8
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Power, 1.9W
10.0-13.25 GHz
Assembly and Bonding Diagram
Assembly Instructions:
Die Attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less than
7 minutes. Refer to Application Note AN3017 for more detailed information.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge
bond techniques. For DC pad connections, use either ball or wedge bonds. For best
RF performance, use wedge bonds of shortest length, although ball bonds are also
acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
Die Handling:
Refer to Application Note AN3016.
Figure 24. Recommended operational configuration. Wire bond as shown.
0.01-0.1μF
V
GG
VDD
VGG
Gnd
RF
GND
RF
IN
100 Ω
GG
200 pF
200 pF
before applying positive bias to V
100-
100-
200 pF
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200 pF
100-
100-
200 pF
200 pF
100-
100-
GND
V
DD
DD
MAAPGM0070-DIE
0.01-0.1μF
to prevent
Preliminary Datasheet
RF
OUT
Rev B