MAAPGM0053-DIE MACOM [Tyco Electronics], MAAPGM0053-DIE Datasheet - Page 4

• Manufacturer Part Number: MAAPGM0053-DIE
• Description: Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz
• Manufacturer: MACOM [Tyco Electronics]

4
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Distributed Power, 0.5 W
2.0-18.0 GHz
Mechanical Information
Chip Size: 3.000 x 2.000 x 0.075 mm
Bond Pad Dimensions
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
0.177mm
1.838mm
0.467mm
RF In and Out
0
Pad
0
GND:G
GND:G
Chip edge to bond pad dimensions are shown to the center of the bond pad.
IN
GND:G
GND:G
GND:G
GND:G
Figure 7. Die Layout
GND:G
GND:G
VD
GND:G
(
GND:G
118 x 79 x 3 mils)
Size (μm)
100 x 150
150 x 150
150 x 150
GND:G
GND:G
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Visit www.macom.com for additional data sheets and product information.
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
VG
G ND:G
G ND:G
GND:D
G ND:G
GND:D
G ND:G
OUT
GND:G
GND:G
Size (mils)
4 x 8
8 x 6
4 x 6
MAAPGM0053-DIE
Preliminary Information
1.216mm
2.000mm
903217 —