MAAPGM0036-DIE MACOM [Tyco Electronics], MAAPGM0036-DIE Datasheet - Page 5

• Manufacturer Part Number: MAAPGM0036-DIE
• Description: 1.2-3.2 GHz 1.2W Power Amplifier
• Manufacturer: MACOM [Tyco Electronics]

5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
1.2-3.2 GHz 1.2W Power Amplifier
Bond Pad Dimensions
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
2.982mm.
2.830mm.
1.492mm.
0.154mm.
Mechanical Information
Chip Size: 2.986 x 2.982 x 0.075 mm
RF In and Out
Pad
0
Chip edge to bond pad dimensions are shown to the center of the bond pad.
0
Figure 5. Die Layout
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Size (µm)
100 x 200
200 x 150
150 x 150
(
118 x 117 x 3 mils)
0.152mm.
2.830mm.
1.492mm.
MAAPGM0036-DIE
Size (mils)
Preliminary Information
4 x 8
8 x 6
6 x 6
RO-P-DS-3017 B