MAAPGM0018-DIE MACOM [Tyco Electronics], MAAPGM0018-DIE Datasheet - Page 6

• Manufacturer Part Number: MAAPGM0018-DIE
• Description: 2W Ku-Band Power Amplifier 12.0-15.5 GHz
• Manufacturer: MACOM [Tyco Electronics]

Specifications subject to change without notice.
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2W Ku-Band Power Amplifier
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Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
Note: Indicated V
pads between V
Note: Indicated V
V
GG
Support circuitry typical of MMIC characterization fixture for CW testing.
Figure 6. Recommended bonding diagram for pedestal mount.
35 Ω
GG
RF
D 1, 2
GG
pads represent the nominal bias configuration. Optionally, the V
IN
pads represent the nominal bias configuration. Optionally, the V
and V
100 pF
100 pF
V
V
GG
GG
0.1 µF
0.1 µF
D3
and V
can be used if more convenient.
D3
can be used if more convenient.
0.1 µF
0.1 µF
100 pF
100 pF
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V
V
D1, 2
D1, 2
GG
before applying positive bias to V
V
V
GG
GG
0.1 µF
0.1 µF
100 pF
100 pF
V
V
GG
D3
D3
pads between V
RF
MAAPGM0018-DIE
V
V
DD
DD
OUT
DD
D 1, 2
to prevent
GG
V 1.00