MAAP-000079-MCH000 MACOM [Tyco Electronics], MAAP-000079-MCH000 Datasheet - Page 8

• Manufacturer Part Number: MAAP-000079-MCH000
• Description: Amplifier, Power, 20W 7.5-10.5 GHz
• Manufacturer: MACOM [Tyco Electronics]

8
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Power, 20W
7.5-10.5 GHz
Assembly and Bonding Diagram
Assembly Instructions:
Die Attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less
than 7 minutes. Refer to Application Note AN3017 for more detailed information.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge
bond techniques. For DC pad connections, use either ball or wedge bonds. For
best RF performance, use wedge bonds of shortest length, although ball bonds are
also acceptable.
Biasing Note: Must apply negative bias to V
V
Thermal Management is critical on this
part. Refer to Application Note AN3019
for applicable guidelines.
NOTE 1:
cessed by going to http://www.macom.com/
Application%20Notes/index.htm.
NOTE 2: In implementing the DC/ RF cross-
over shown, the following rules must applied.
1.
2.
3. the rated current capability of the DC
4.
Die Handling:
Refer to Application Note AN3016.
DD
to prevent damage to amplifier.
crossovers should be greater than the
maximum current of the device; and
the DC crossovers should approach and
cross the RF trace at a 90 degree angle;
the printed DC traces that approach the
RF line should be stopped 2 substrate
heights from the RF line edge;
the wires or ribbons used to make the DC
crossovers should clear the RF trace by
~ 1 substrate height.
All Application Notes may be ac-
Figure 13. Recommended operational configuration. Wire bond as shown.
GG
before applying positive bias to
V
GG
VDD
VGG
Gnd
RF
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Visit www.macom.com for additional data sheets and product information.
Crossover
RF
Gate
0.1 F
0.01-
GN D
IN
20
1 00 -
2 0 0
1 0 0-
2 0 0
p F
p F
1 00 -
2 00
1 0 0-
2 0 0
p F
p F
1 00 -
2 0 0
1 0 0-
p F
20 0
p F
MAAPGM0079-DIE
Preliminary Datasheet
1 00 -
2 00
1 00 -
2 00
pF
pF
0.1 F
0.01-
V
D D
Rev A
Crossover
Drain
RF
OUT