HI-3189CDI HOLTIC [Holt Integrated Circuits], HI-3189CDI Datasheet
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HI-3189CDI
Related parts for HI-3189CDI
HI-3189CDI Summary of contents
Page 1
... DEI3182A. Inputs are provided for clocking and synchronization. These signals are AND'd with the DATA inputs to enhance system performance and allow the HI-3189 to be used in a variety of applications. Both logic and synchronization inputs feature built-in 2,000V minimum ESD input protection as well as TTL and CMOS compatibility ...
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... OUTPUT DRIVER (A) LEVEL SHIFTER AND SLOPE CONTROL (A) LEVEL SHIFTER AND SLOPE CONTROL (B) OUTPUT DRIVER (B) GND -VS CAPB Figure 2. Functional Block Diagram HOLT INTEGRATED CIRCUITS 2 Comments ARINC 429 High-Speed ARINC 429 Low-Speed ARINC 429 Low-Speed Not Used +VS AMPA 37.5W OUTA - +VS 37.5W OUTB AMPB -VS ...
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... ARINC 429 bus application: +15V for +VS, -15V for -VS and +5V for both VREF and VLOGIC. The differential output swing of the HI-3189 is equal VREF. Using +5V gives a differential output swing of 10V different output voltage swing is required, an additional power supply is needed to set VREF ...
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... REF t R DIFFERENTIAL OUTPUT 0V (OUTA - OUTB) NOTE: OUTPUTS UNLOADED AC ELECTRICAL CHARACTERISTICS +V = +15V -15V +5.0V, T LOGIC REF PARAMETER A B Rise Time ( , ) - High Speed OUT OUT A B Fall Time ( , ) - High Speed OUT OUT A B Rise Time ( , ) - Low Speed OUT OUT A B Fall Time ( ...
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... OUTA and/or OUTB shorted line-to-line GND. Outputs High or Low I OUTA and/or OUTB shorted line-to-line SC+ GND. Outputs High or Low I OUTA and/or OUTB shorted line-to-line SC- GND. Outputs High or Low HOLT INTEGRATED CIRCUITS 5 MIN TYP MAX UNITS 300 µ ...
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... NUMBER DESCRIPTION CD 16 PIN CERAMIC SIDE BRAZED DIP (16C PIN CERAMIC LEADLESS CHIP CARRIER (LCC) (28S) Gold (’M’ Flow: Solder) 60°C/W 25°C PIN CERDIP (16D) not available with ‘M’ flow HI-3189 (See page 1 for 16-Pin Ceramic Side-Brazed DIP)) ...
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... REVISION HISTORY Revision Date DS-3189, Rev. New 08/22/08 HI-3189 Description of Change Initial Release HOLT INTEGRATED CIRCUITS 7 ...
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... Standard 95) 16-PIN CERAMIC SIDE-BRAZED DIP .125 min (3.175) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HI-3189 PACKAGE DIMENSIONS .050 max .790 max (1.27 max) .288 ±.005 (7.315 ±.125) .100 BSC (2 ...
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... CERAMIC LEADLESS CHIP CARRIER .020 INDEX (.508) PIN 1 .040 x 45° 3PLS (1.016 x 45° 3PLS) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HI-3189 PACKAGE DIMENSIONS .080 ±.020 (2.032 ±.508) .451 ± ...