W55MID50 WINBOND [Winbond], W55MID50 Datasheet - Page 7

• Manufacturer Part Number: W55MID50
• Description: WINBOND MFID READER
• Manufacturer: WINBOND [Winbond]

Electronic Characteristics
3.1 W55MID50 Absolute Maximum Ratings
Note:
3.2 W55MID50 DC Characteristics
(VDD-VSS = 4.5 V, Ta = 25°C; unless otherwise specified)
3.3 W55MID50 Ordering Information
Winbond Electronics Corp.
Operating Magnetic Field
Operating Voltage
Operating Temperature
Operating Current
Stand-by Current
Sink Current
Source Current
Maximum Current in COIL
Power Dissipation (T
Ambient Operating Temperature
Storage Temperature
Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
W55MID50 provides two types of package in shipment: Dice form, PDIP-20, SOP-20, and Wafer
Part Number
Parameter
W55MID50
W55MID50
W55MID50
W55MID50
Parameter
a
= 70°C)
Dice form
PDIP-20
SOP-20
Wafer form
Package
Sym.
Tamb
V
f
I
I
I
I
OP
OP
SB
SK
SR
DD
7
Field in resonation
Field in resonation
Ambient operating temp
f
Power Down mode enter
VoL = 0.3VDD
VoH = 0.7VDD
OP
= 13.56MHz
MOQ required
Conditions
-40 to +85
0 to +70
Rating
100
10
Remarks
W55MID50 Data Sheet
Revision: A3
Min.
3
-
0
-
-
-
-
13.56
Typ.
0.7
25
22
10
-6
-
Unit
mW
mA
Publish Date: 2003/3/24
°C
°C
Max.
5.5
70
1
-
-
-
-
Unit
MHz
mA
mA
mA
uA
°C
V