LX5510 Microsemi Corporation, LX5510 Datasheet

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LX5510

Manufacturer Part Number

LX5510

Description

Manufacturer

Microsemi Corporation

Datasheet

1.LX5510.pdf (7 pages)

Specifications of LX5510

Case

QFN

Date_code

2004

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Meier Automation Equipment Co., Limited

Part Number:

LX5510B

Manufacturer:

MICROSEMI/美高森美

Quantity:

20 000

Company:

Bonase Electronics (HK) Co., Limited

Bonase Electronics (HK) Co., Limited

Part Number:

LX5510BLQ

Manufacturer:

AKM

Quantity:

36

Company:

Meier Automation Equipment Co., Limited

Meier Automation Equipment Co., Limited

Part Number:

LX5510BLQ

Manufacturer:

MICROSEMI/美高森美

Quantity:

20 000

Company:

Bonase Electronics (HK) Co., Limited

Bonase Electronics (HK) Co., Limited

Part Number:

LX5510BLQTR

Manufacturer:

Microsem

Quantity:

718

Company:

Meier Automation Equipment Co., Limited

Meier Automation Equipment Co., Limited

Part Number:

LX5510LQ

Manufacturer:

MICROS

Quantity:

20 000

Company:

Bonase Electronics (HK) Co., Limited

Bonase Electronics (HK) Co., Limited

Part Number:

LX5510LQTR

Manufacturer:

YEONHO

Quantity:

1 175

Current page: 1 of 7
Download datasheet (627Kb)

Copyright  2003

Rev. 0.3g, 2003-05-08

The LX5510 is a power amplifier

optimized for WLAN applications in

the 2.4-2.5GHz frequency range. The

PA is implemented as a two-stage

monolithic

circuit (MMIC) with active bias and

input/output pre-matching.

The device is manufactured with an

InGaP/GaAs Heterojunction Bipolar

Transistor

(MOCVD). With single low voltage

supply of 3.3V 20dB power gain

between

quiescent current of 65mA.

IMPORTANT: For the most current data, consult MICROSEMI’s website:

I N T E G R A T E D

2.4-2.5GHz,

microwave

(HBT)

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

IC

at

integrated

D E S C R I P T I O N

a

process

P R O D U C T S

low

For +19dBm OFDM output power

(64QAM, 54Mbps), the PA provides a

low EVM (Error-Vector Magnitude) of

3.0%, and consumes 120mA total DC

current with the nominal 3.3V bias.

With increased bias of 4.5V EVM is ~

5% at 23dBm.

The LX5510 is available in a 16-pin

3mmx3mm micro-lead package (MLP).

The compact footprint, low profile, and

excellent thermal capability of the MLP

package makes the LX5510 an ideal

solution

amplifier

802.11b/g applications

P R O D U C T H I G H L I G H T

Append the letter “T” to the part number.

Integrated Products Division

LQ

P A C K A G E O R D E R

Note: Available in Tape & Reel.

for

Microsemi

requirements

http://www.microsemi.com

Plastic MLPQ

16 pin

(i.e. LX5510-LQT)

LX5510-LQ

medium-gain

I N F O

InGaP HBT 2.4 – 2.5 GHz Power Amplifier

for

power

IEEE

P

RELIMINARY

Advanced InGaP HBT

2.4 – 2.5GHz Operation

Single-Polarity 3.3V Supply

Low Quiescent Current Icq

~65mA

Power Gain ~20dB @ 2.45GHz

and Pout = 19dBm

Total Current 120mA for Pout =

19dBm @ 2.45GHz OFDM

EVM ~ 3.0% for 64QAM /

54Mbps and Pout = 19dBm

Small Footprint (3x3mm

Low Profile (0.9mm)

IEEE 802.11b/g

D

C

C

ATA

K E Y F E A T U R E S

A P P L I C A T I O N S

O

O

S

N

N

HEET

F

F

I

I

D

D

E

E

LX5510

N

2

N

)

T

T

I

I

Page 1

A

A

L

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