MH201210NJL ABC [ABC Taiwan Electronics Corp], MH201210NJL Datasheet

MH201210NJL

Manufacturer Part Number

MH201210NJL

Description

MULTILAYER CHIP INDUCTOR

Manufacturer

ABC [ABC Taiwan Electronics Corp]

Datasheet

1.MH201210NJL.pdf (6 pages)

Current page: 1 of 6
Download datasheet (107Kb)

REF :

AR-001A

PROD.

NAME

Ⅰ﹒CONFIGURATION & DIMENSIONS：

Ⅱ﹒SCHEMATIC DIAGRAM：

Ⅲ﹒FEATURES：

Ⅳ﹒APPLICATIONS：

Ⅴ﹒GENERAL SPECIFICATION：

c﹒Terminal：Ag/Cu/Ni/Sn

d﹒Remark：Products comply with RoHS' requirements

a﹒Monolithic structure ensuring high performance and reliability.

b﹒High frequency applications up to 6GHz.

a﹒RF modules for telecommunication systems including

a﹒Storage temp.：-55℃---- +125℃

b﹒Operating temp.：-55℃ ---- +125℃

c﹒Solderability：Preheat 150℃. 60 sec

GSM, PCS,DECT,WLAN,Bluetooth,etc.

MULTILAYER CHIP INDUCTOR

Solder：H63A

Solder temp.：230±5℃

Flux：Rosin

Dip time：4±1 sec

Peak Temp：260℃ max.

Max time above 230℃ ：50sec max.

Max time above 200℃ ：70sec max.

ABC'S ITEM NO.

250

200

150

100

ABC'S DWG NO.

+4.0

Temperature

Rising Area

℃

/ sec max.

150 ~ 200

A : 2.00±0.20

D : 0.50±0.30

Preheat Area

℃

100

: 1.20±0.20

: 0.85±0.20

/ 60 ~ 120sec

Time ( seconds )

MH2012□□□□L□-□□□

150

Reflow Area

+2.0 ~ 4.0 ℃

/ sec max.

70sec max.

50sec max.

200

-(1.0 ~ 5.0)

Forced Cooling Area

m/m

Peak Temperature:

260

℃

/ sec max.

230

℃

PAGE: 1

250

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