MSM7510GS-K OKI [OKI electronic componets], MSM7510GS-K Datasheet
MSM7510GS-K
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MSM7510GS-K Summary of contents
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... ALB (Analog–Loop back) with test mode. • 3.579545 MHz Crystal Oscillator • Digital Interface: TTL • Package options: 16-pin plastic DIP (DIP16-P-300-2.45) 24-pin plastic SOP (SOP24-P-430-1.27-K) This version: Jan. 1998 Previous version: Nov. 1996 (Product name: MSM7510RS) (Product name: MSM7510GS-K) MSM7510 1/12 ...
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Semiconductor BLOCK DIAGRAM AI + (2) – *R1 *R1 *R2 *R2 – (3) EAI (4) X1 (6) CLK GEN. OSC X2 (7) CLK ( (1) SG GEN. GND (5) Demodulator FSK & ANS Bandpass AOG Filter ...
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Semiconductor PIN CONFIGURATION (TOP VIEW EAI 4 GND CLK 8 16-Pin Plastic DIP 16 AOG MOD2 MOD1 NC 4 ...
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Semiconductor PIN DESCRIPTION No. Name I/O RS GS- — EAI GND — CLK ...
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Semiconductor ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Input Voltage Storage Temperature RECOMMENDED OPERATING CONDITIONS Parameter Power Supply Voltage Operating Temperature Input Clock Frequency V Bypass Capacitor DD Oscillation Frequency Frequency Deviation Temperature Characteristics Equivalent Series Resistance Load Capacitance ELECTRICAL ...
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Semiconductor AC Characteristics Modulator/analog output (AO) characteristics Parameter Symbol f OM FSK Transmit f OS Signal Frequency Answer Tone f AST Frequency FSK Transmit V AO1 Signal, Answer V AO2 Tone Amplitude Analog External ...
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Semiconductor Demodulator/analog input (Al, EAI) characteristics Parameter Symbol Receive Signal V AI Amplitude Receive Signal V ON Detect Amplitude (CD) V OFF Hysteresis (CD) V HYS CD Delay Time t CDD CD Hold Time t CDH Receive Data (RD) D ...
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Semiconductor OPERATION MODE MOD2 MOD1 Answer Tone Transmit "0" Answer Tone Detect: When transmitting the answer tone held at digital "1". AI Receive Filter Phone Line AO ...
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Semiconductor APPLICATION CIRCUIT 2.2 mF 600 W : 600 W – Lone 2.2 mF 600 W : 600 W – Line External Clock 3.58 MHz MSM7510RS 600 W EAI GND ...
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Semiconductor An Example of the External Adjustment for a Transmitting Level and Detecting Level If you desire to change the transmitting level or detecting level, adjust the external circuit by referring to the following circuit VAOL Line 600 ...
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Semiconductor PACKAGE DIMENSIONS DIP16-P-300-2.54 MSM7510 (Unit : mm) Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating Solder plate thickness more Package weight (g) 0.99 TYP. 11/12 ...
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Semiconductor SOP24-P-430-1.27-K Mirror finish Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in ...