EPC120 EPC [Espros Photonics corp], EPC120 Datasheet - Page 26

• Manufacturer Part Number: EPC120
• Description: Fully integrated Light-Barrier Chips with 2-Wire Bus Interface
• Manufacturer: EPC [Espros Photonics corp]

For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for
Pb-free assembly for both types of packages. The peak soldering t emperature (T
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
Reflow Solder Profile
Packaging Information
Tape & Reel Information
The devices are mounted on embossed tape for automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13 inch)
reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and indicate the
tape sizes for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association (EIA) standard
481-1, 481-2, 481-3.
ESPROS Photonics AG does not guarantee that there are no empty cavities. Thus, the pick-and-place machine should check the presence of
a chip during picking.
Ordering Information
Type
epc120-CSP10
epc120-QFN16
CSP6 Tape
CSP6 Tape
(all measures in mm)
Package
QFN16
CSP10
4
2
Figure 26: CSP10 and QFN16 Tape Dimensions
Pin 1
Pin 1
26
QFN16 Tape
QFN16 Tape
RoHS compliance
L
) should not exceed +260°C for a maximum of 4 sec.
Yes
Yes
8
8
Pin 1
Pin 1
Packaging
Method
Reel
Reel
Datasheet epc12x - V2.1
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epc120