EPC111 EPC [Espros Photonics corp], EPC111 Datasheet - Page 11

• Manufacturer Part Number: EPC111
• Description: Fully integrated standalone light barrier driver & receiver
• Manufacturer: EPC [Espros Photonics corp]

Layout Information
CSP-10 Package
Recommendations for reliable soldering of solder balls:
QFN-16 Package
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
•
•
•
0.15
Use a pad layout similar to the one shown in Figure 14. Notice that all tracks should go underneath the solder mask area.
Do not connect any pins direct pin to pin inside of the opening of the solder mask.
In case of the conductors are with a Au-Ni surface finish the preferred landing pad design for the solder balls will be covering the
round landing pad with a gold surface finish as a solderable area only.
Figure 13: CSP10: Mechanical dimensions
Bottom View
0.5
∅ 0.12
1.9 +0.0/-0.1
0.5
(all measures in mm,
NC_GND
NC_GND
Solder balls Sn97.5Ag2.5
LED
File: Unben annt
NC
Part Name
<Partname>
Figure 15: QFN-16: Layout recommendation
Pin 1
12
1
)
11
2
Top View
This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form wi
File:
10
3
Designed
Approved
Scale
Page
11
Part No.
1
<Name>
<Name>
M 1:1
<x000 000>
9
4
<Data>
DIN A4
26.02.2009
NC_GND
GND
PD
NC_GND
Figure 14: CSP10: Layout recommendation
Shielding of PD pin
Opening in solder mask
Conductor layout
∅ 0.3
no solder mask inside this area
0.5
0.5
2.5
Datasheet epc111_112 - V2.2
0.1524
epc111/112
www.espros.ch