MC74VHCT259AMG ON Semiconductor, MC74VHCT259AMG Datasheet - Page 4

• Manufacturer Part Number: MC74VHCT259AMG
• Description: IC LATCH/DECODER/SHIFTR 16SOEIAJ
• Manufacturer: ON Semiconductor
• Series: 74VHCTr

Specifications of MC74VHCT259AMG

• Logic Type: D-Type, Addressable
• Circuit: 1:8
• Output Type: Standard
• Voltage - Supply: 4.5 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 6ns
• Current - Output High, Low: 8mA, 8mA
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (5.3mm Width), 16-SO, 16-SOEIIJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Tested to EIA/JESD22−A114−A
2. Tested to EIA/JESD22−A115−A
3. Tested to JESD22−C101−A
4. Tested to EIA/JESD78
DEVICE JUNCTION TEMPERATURE VERSUS TIME TO
0.1% BOND FAILURES
MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
I
Symbol
Temperature °C
Symbol
LATCHUP
V
V
V
T
I
V
V
V
t
V
I
OUT
I
q
P
OUT
T
OUT
I
STG
ESD
r
OK
CC
, t
CC
CC
IK
JA
Junction
IN
IN
A
D
f
100
110
120
130
140
80
90
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature Range, all Package Types
Input Rise or Fall Time
Positive DC Supply Voltage
Digital Input Voltage
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, V
Power Dissipation in Still Air
Storage Temperature Range
ESD Withstand Voltage
Latchup Performance
Thermal Resistance, Junction−to−Ambient
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
CC
and GND Pins
Characteristics
Time, Years
117.8
Parameter
47.9
20.4
Above V
9.4
4.2
2.0
1.0
MC74VHCT259A
http://onsemi.com
CC
and Below GND at 125°C (Note 4)
Charged Device Model (Note 3)
4
Human Body Model (Note 1)
Figure 5. Failure Rate vs. Time Junction Temperature
Machine Model (Note 2)
V
CC
High or Low State
Output in 3−State
1
High or Low State
Output in 3−State
= 5.0 V + 0.5 V
1
SOIC Package
SOIC Package
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TSSOP
TSSOP
10
TIME, YEARS
Min
−55
4.5
0
0
0
0
−0.5 to V
−0.5 to +7.0
−0.5 to +7.0
−0.5 to +7.0
−65 to +150
>2000
>2000
Value
$300
>200
$20
$25
$75
−20
200
180
143
164
CC
Max
V
125
5.5
5.5
5.5
20
100
CC
+0.5
ns/V
Unit
°C
1000
°C/W
V
V
V
Unit
mW
mA
mA
mA
mA
mA
°C
V
V
V
V