MC14007UBCP ON Semiconductor, MC14007UBCP Datasheet - Page 8
MC14007UBCP
Manufacturer Part Number
MC14007UBCP
Description
IC INVERTER DUAL COMP 14DIP
Manufacturer
ON Semiconductor
Series
4000Br
Datasheet
1.MC14007UBCPG.pdf
(9 pages)
Specifications of MC14007UBCP
Logic Type
Configurable Multiple Function
Number Of Circuits
2
Number Of Inputs
1
Schmitt Trigger Input
No
Output Type
Single-Ended
Current - Output High, Low
10mA, 10mA
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
MC14007UBCPOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC14007UBCP
Manufacturer:
MOTOROLA
Quantity:
25
Part Number:
MC14007UBCP
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
0.58
T
14X
K
B
S
C
P
7 PL
A
S
0.25 (0.010)
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
R
http://onsemi.com
1
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE H
M
7.04
B
7X
8
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_