NBSG86AMNG ON Semiconductor, NBSG86AMNG Datasheet - Page 13
NBSG86AMNG
Manufacturer Part Number
NBSG86AMNG
Description
IC SMART GATE SIGE DIFF 16QFN
Manufacturer
ON Semiconductor
Specifications of NBSG86AMNG
Logic Type
Configurable Multiple Function
Number Of Circuits
2
Number Of Inputs
2
Schmitt Trigger Input
No
Output Type
Differential
Voltage - Supply
2.375 V ~ 3.465 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-TFQFN Exposed Pad
Product
MUX Gates
High Level Output Current
- 25 mA
Low Level Output Current
25 mA
Propagation Delay Time
0.215 ns
Supply Voltage (max)
+/- 3.465 V
Supply Voltage (min)
+/- 2.375 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output High, Low
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
NBSG86AMNGOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NBSG86AMNG
Manufacturer:
ON Semiconductor
Quantity:
4
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
-Y-
3 X
E
A
e
0.20
S
A2
-X-
ROTATED 90 CLOCKWISE
A1
VIEW M-M
4
DETAIL K
3
D
_
4
2
PLASTIC 4 X 4 (mm) BGA FLIP CHIP PACKAGE
1
A
B
C
D
0.10 Z
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
16 X
16 X
PACKAGE DIMENSIONS
3
5
0.15 Z
b
http://onsemi.com
0.15
0.08
-Z-
CASE 489-01
BA SUFFIX
FCBGA-16
NBSG86A
M
M
ISSUE O
K
Z
Z
13
X
M
M
Y
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
PER ASME Y14.5M, 1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
A1
A2
A
b
D
E
e
S
MILLIMETERS
MIN
0.25
0.30
1.40 MAX
1.20 REF
4.00 BSC
4.00 BSC
1.00 BSC
0.50 BSC
MAX
0.35
0.50