SFC05-5.WC Semtech Corporation, SFC05-5.WC Datasheet

SFC05-5.WC

Manufacturer Part Number

SFC05-5.WC

Description

Manufacturer

Semtech Corporation

Datasheets

1.SFC05-5.WC.pdf (7 pages)

2.SFC05-5.WC.pdf (7 pages)

Specifications of SFC05-5.WC

Date_code

04+

Packing_info

BGA

Available stocks

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Part Number

Manufacturer

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Price

Company:

BOSTOCK HK LIMITED

Part Number:

SFC05-5.WCT

Manufacturer:

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Download datasheet (214Kb)

The SFC05-5 is a five line flip chip TVS array. They are

state-of-the-art devices that utilize solid-state silicon-

avalanche technology for superior clamping perfor-

mance and DC electrical characteristics. The SFC

series TVS diodes are designed to protect sensitive

semiconductor components from damage or latch-up

due to electrostatic discharge (ESD) and other voltage

induced transient events.

The SFC05-5 is a 6-bump, 0.5mm pitch flip chip array

with a 3x2 bump grid. It measures 1.5 x 1.0 x

0.65mm. This small outline makes the SFC05-5

especially well suited for portable applications. CSP

TVS devices are compatible with current pick and place

equipment and assembly methods.

Each device will protect up to five data or I/O lines.

The flip chip design results in lower inductance, virtually

eliminating voltage overshoot due to leads and inter-

connecting bond wires. They may be used to meet the

ESD immunity requirements of IEC 61000-4-2, Level 4

(±15kV air, ±8kV contact discharge).

Revision 08/02/04

PROTECTION PRODUCTS

Description

Device Dimensions

SFC05-5 Maximum Dimensions (mm)

Features

Mechanical Characteristics

Applications

Schematic & PIN Configuration

200 Watts peak pulse power (tp = 8/20µs)

Transient protection for data lines to

IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)

IEC 61000-4-4 (EFT) 40A (5/50ns)

IEC 61000-4-5 (Lightning) 20A (8/20µs)

Small chip scale package requires less board space

Low profile (< 0.65mm)

No need for underfill material

Protects five I/O or data lines

Low clamping voltage

Working voltage: 5V

Solid-state silicon-avalanche technology

JEDEC MO-211, 0.50 mm Pitch Flip Chip Package

Non-conductive top side coating

Marking : Marking Code

Packaging : Tape and Reel

Cell Phone Handsets and Accessories

Personal Digital Assistants (PDA’s)

Notebook and Hand Held Computers

Portable Instrumentation

Smart Cards

MP3 Players

GPS

3 x 2 Grid CSP TVS (Bottom View)

Flip Chip TVS Diode Array

ChipClamp

PRELIMINARY

SFC05-5

www.semtech.com

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