AM29F400B-1 AMD [Advanced Micro Devices], AM29F400B-1 Datasheet

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AM29F400B-1

Manufacturer Part Number
AM29F400B-1
Description
4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1
Manufacturer
AMD [Advanced Micro Devices]
Datasheet
Am29F400B Known Good Die
4 Megabit (512 K x 8-Bit/256 K x 16-Bit)
CMOS 5.0 Volt-only, Boot Sector Flash Memory—Die Revision 1
DISTINCTIVE CHARACTERISTICS
Single power supply operation
— 5.0 volt-only operation for read, erase, and
— Minimizes system level requirements
Manufactured on 0.35 µm process technology
— Compatible with 0.5 µm Am29F400 device
High performance
— Acess time as fast as 70 ns
Low power consumption (typical values at 5
MHz)
— 1 µA standby mode current
— 20 mA read current (byte mode)
— 28 mA read current (word mode)
— 30 mA program/erase current
Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
— One 8 Kword, two 4 Kword, one 16 Kword, and
— Supports full chip erase
— Sector Protection features:
program operations
seven 64 Kbyte sectors (byte mode)
seven 32 Kword sectors (word mode)
A hardware method of locking a sector to
prevent any program or erase operations within
that sector
Sectors can be locked via programming
equipment
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
SUPPLEMENT
Top or bottom boot block configurations
available
Embedded Algorithms
— Embedded Erase algorithm automatically
— Embedded Program algorithm automatically
Minimum 1,000,000 write cycle per sector
guaranteed
Compatibility with JEDEC standards
— Pinout and software compatible with single-
— Superior inadvertent write protection
Data# Polling and toggle bits
— Provides a software method of detecting
Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting
Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
Hardware reset pin (RESET#)
— Hardware method to reset the device to reading
preprograms and erases the entire chip or any
combination of designated sectors
writes and verifies data at specified addresses
power-supply Flash
program or erase operation completion
program or erase cycle completion
or program data to, a sector that is not being
erased, then resumes the erase operation
array data
Publication# 21258
Issue Date: April 1998
Rev: B Amendment/+1

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AM29F400B-1 Summary of contents

Page 1

... SUPPLEMENT Am29F400B Known Good Die 4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS Single power supply operation — 5.0 volt-only operation for read, erase, and program operations — Minimizes system level requirements Manufactured on 0.35 µm process technology — ...

Page 2

... GENERAL DESCRIPTION The Am29F400B in Known Good Die (KGD) form Mbit, 5.0 volt-only Flash memory. AMD defines KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same relia- bility and quality as AMD products in packaged form. Am29F400B Features The Am29F400B Mbit, 5 ...

Page 3

... Gel-Pak 5 -75 = 5 DIE PAD LOCATIONS Am29F400B Known Good Die Am29F400B KGD -90 -120 90 120 90 120 ...

Page 4

... Am29F400B Known Good Die Pad Center (millimeters 0.0000 0.0000 0.1835 0.0000 0.3417 0.0000 0.4977 0.0000 0.6559 0.0000 0.8119 0.0000 0.9701 0.0000 1.1261 0.0000 1.2843 0.0000 1.4887 –0.0361 1 ...

Page 5

... BOOT CODE SECTOR ARCHITECTURE T = Top sector B = Bottom sector DEVICE NUMBER/DESCRIPTION Am29F400B Known Good Die 4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS Flash Memory—Die Revision 1 5.0 Volt-only Program and Erase Valid Combinations list configurations planned to be sup- ported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations ...

Page 6

... PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29F400B product qualification database supple- ment for KGD. AMD implements quality assurance pro- cedures throughout the product test flow. In addition, Packaging for Shipment ...

Page 7

... AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. (max) = 130 C J Storage Store at a maximum temperature nitrogen- purged cabinet or vacuum-sealed bag. Observe all standard ESD handling procedures. Am29F400B Known Good Die (Bottom Boot .98965ABK 7 ...

Page 8

... Buyer’s use of AMD products for use in life support applications is at Buyer’s own risk and Buyer agrees to fully indem- nify AMD for any damages resulting in such use or sale. Am29F400B Known Good Die ...

Page 9

... Product names used in this publication are for identification purposes only and may be trademarks of their respective companies Global Added -75 and -90 speed options. Pad Description Corrected coordinates for pads 2, 19, 22, 35, 40, and 42. Physical Specifications Changed die thickness specification to ~20 mils. Am29F400B Known Good Die 9 ...

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