ADIS16204_07 AD [Analog Devices], ADIS16204_07 Datasheet - Page 21

• Manufacturer Part Number: ADIS16204_07
• Description: Programmable High-g Digital Impact Sensor and Recorder
• Manufacturer: AD [Analog Devices]

SECOND-LEVEL ASSEMBLY
The ADIS16204 can be attached to the second-level assembly
board using SN63 (or equivalent) or a Pb-free solder. Figure 26
and Table 41 provide acceptable solder reflow profiles for each
solder type. Note that these profiles may not be the optimum
profile for the user’s application. In no case should 260°C be
exceeded. It is recommended that the user develop a reflow
profile based upon the specific application.
In general, keep in mind that the lowest peak temperature and
shortest dwell time above the melt temperature of the solder
results in less shock and stress to the product. In addition,
evaluating the cooling rate and peak temperature can result
in a more reliable assembly.
Table 41. Acceptable Solder Reflow Profiles
Profile Feature
Average Ramp Rate (T
Preheat
T
Time Maintained Above Liquidous Temperature(T
Peak Temperature (T
Time Within 5°C of Actual T
Ramp-Down Rate
Time 25°C to T
1
Per IPC/JEDEC J-STD-020C.
SMAX
Minimum Temperature (T
Maximum Temperature (T
Time (T
Ramp-Up Rate
Liquidous Temperature (T
Time (t
to T
L
L
SMIN to
)
P
T
SMAX
) (t
P
)
L
s
to T
)
P
p
)
SMAX
SMIN
L
)
)
)
1
L
)
Rev. 0 | Page 21 of 24
T
T
P
L
T
SMIN
T
SMAX
Sn63/Pb37
3°C/sec max
100°C
150°C
60 sec to 120 sec
3°C/sec
183°C
60 sec to 150 sec
240°C + 0°C/–5°C
10 sec to 30 sec
6°C/sec max
6 min max
Figure 26. Acceptable Solder Reflow Profiles
PREHEAT
t25°C TO PEAK
t
S
RAMP-UP
Condition
TIME
Pb-Free
3°C/sec max
150°C
200°C
60 sec to180 sec
3°C/sec
217°C
60 sec to 150 sec
260°C + 0°C/–5°C
20 sec to 40 sec
6°C/sec max
8 min max
RAMP-DOWN
t
P
t
L
ADIS16204
CRITICAL ZONE
T
L
TO T
P