ADIS16003PCB AD [Analog Devices], ADIS16003PCB Datasheet - Page 14

• Manufacturer Part Number: ADIS16003PCB
• Manufacturer: AD [Analog Devices]

ADIS16003
APPLICATIONS
DUAL-AXIS TILT SENSOR
One of the most popular applications of the ADIS16003 is tilt
measurement. An accelerometer uses the force of gravity as an
input vector to determine the orientation of an object in space.
An accelerometer is most sensitive to tilt when its sensitive axis
is perpendicular to the force of gravity, that is, parallel to the
earth’s surface. At this orientation, its sensitivity to changes in
tilt is highest. When the accelerometer is oriented on axis to
gravity, near its +1 g or –1 g reading, the change in output
acceleration per degree of tilt is negligible. When the acceler-
ometer is perpendicular to gravity, its output changes nearly
17.5 mg per degree of tilt. At 45°, its output changes at only
12.2 mg per degree, and resolution declines.
Converting Acceleration to Tilt
When the accelerometer is oriented so both its x-axis and y-axis
are parallel to the earth’s surface, it can be used as a 2-axis tilt
sensor with a roll axis and a pitch axis. Once the output signal
from the accelerometer has been converted to an acceleration
that varies between –1 g and +1 g, the output tilt in degrees is
calculated as follows:
Be sure to account for overranges. It is possible for the
accelerometers to output a signal greater than ±1 g due to
vibration, shock, or other accelerations.
SECOND-LEVEL ASSEMBLY
The ADIS16003 may be attached to the second-level assembly
board using SN63 (or equivalent) or lead-free solder. Figure 24
and Table 11 provide acceptable solder reflow profiles for each
solder type. Note: These profiles may not be the optimum
profile for the user’s application. In no case should 260°C be
exceeded. It is recommended that the user develop a reflow
profile based upon the specific application. In general, keep in
mind that the lowest peak temperature and shortest dwell time
above the melt temperature of the solder results in less shock
and stress to the product. In addition, evaluating the cooling
rate and peak temperature can result in a more reliable
assembly.
PITCH = Asin(A
ROLL = Asin(A
Y
/1 g)
X
/1 g)
Rev. 0 | Page 14 of 16
Table 11.
Profile Feature
Average Ramp Rate (T
Preheat
T
Time Maintained Above
Liquidous (T
Peak Temperature (T )
Time Within 5°C of Actual Peak
Temperature (t
Ramp-Down Rate
Time 25°C to Peak Temperature
SMAX
T
T
Minimum Temperature (T
Maximum Temperature (T
Time (T
Ramp-Up Rate
Liquidous Temperature (T
Time (t
P
L
T
to T
SMIN
T
SMAX
L
L
SMIN to
)
L
)
Figure 24. Acceptable Solder Reflow Profiles
p
T
)
SMAX
PREHEAT
t
25°C TO PEAK
t
) (t
S
P
L
s
to T
)
P
)
RAMP-UP
SMAX
SMIN
L
)
)
)
TIME
Sn63/Pb37
3°C/sec max
100°C
150°C
60 sec to
120 sec
3°C/sec
183°C
60 sec to
150 sec
240°C +
0°C/–5°C
10 sec to
30 sec
6°C/sec max
6 min max
RAMP-DOWN
t
P
t
Condition
L
CRITICAL ZONE
T
Pb-free
3°C/sec max
150°C
200°C
60 sec to
150 sec
3°C/sec
217°C
60 sec to
150 sec
260°C +
0°C/–5°C
20 sec to
40 sec
6°C/sec max
8 min max
L
TO T
P