K4H561638F Samsung semiconductor, K4H561638F Datasheet - Page 17

no-image

K4H561638F

Manufacturer Part Number
K4H561638F
Description
256Mb F-die DDR SDRAM Specification
Manufacturer
Samsung semiconductor
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
K4H561638F-GCB3
Manufacturer:
SAMSUNG
Quantity:
328
Part Number:
K4H561638F-TCA2
Manufacturer:
SAMSUNG
Quantity:
17
Part Number:
K4H561638F-TCB3
Manufacturer:
SAMSUNG
Quantity:
90
Part Number:
K4H561638F-TCB3
Manufacturer:
SAMSUNG
Quantity:
179
Part Number:
K4H561638F-TCB3T00
Manufacturer:
SAM
Quantity:
20 000
Part Number:
K4H561638F-TCBO
Manufacturer:
SAMSUNG
Quantity:
5
Part Number:
K4H561638F-UCB3
Manufacturer:
SEC
Quantity:
1 000
Part Number:
K4H561638F-UCB3
Manufacturer:
SAMSUNG
Quantity:
1 000
Company:
Part Number:
K4H561638F-UCB3
Quantity:
3 000
Company:
Part Number:
K4H561638F-UCB3
Quantity:
3 000
Company:
Part Number:
K4H561638F-UCCC
Quantity:
10
Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Table 5 : Output Slew Rate Characteristice (X16 Devices only)
Table 6 : Output Slew Rate Matching Ratio Characteristics
DDR SDRAM 256Mb F-die (x8, x16)
PARAMETER
Output Slew Rate Matching Ratio (Pullup to Pulldown)
Slew Rate Characteristic
Delta Slew Rate
+/- 0.25 V/ns
+/- 0.0 V/ns
+/- 0.5 V/ns
Pullup Slew Rate
Pulldown slew
AC CHARACTERISTICS
+100
tDS
+50
0
Typical Range
1.2 ~ 2.5
1.2 ~ 2.5
(V/ns)
+100
tDH
+50
0
Minimum
(V/ns)
0.7
0.7
TBD
MIN
DDR266
Units
ps
ps
ps
Maximum
MAX
TBD
(V/ns)
5.0
5.0
Notes
0.67
MIN
j
j
j
DDR200
a,c,d,f,g,h
b,c,d,f,g,h
Notes
MAX
1.5
Notes
e,m
Rev. 1.3 October, 2004
DDR SDRAM

Related parts for K4H561638F