K9F1G08Q0M-PCB0 Samsung semiconductor, K9F1G08Q0M-PCB0 Datasheet - Page 17
K9F1G08Q0M-PCB0
Manufacturer Part Number
K9F1G08Q0M-PCB0
Description
1Gb Gb 1.8V NAND Flash Errata
Manufacturer
Samsung semiconductor
Datasheet
1.K9F1G08Q0M-PCB0.pdf
(38 pages)
- Current page: 17 of 38
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System Interface Using CE don’ t-care.
For an easier system interface, CE may be inactive during the data-loading or serial access as shown below. The internal
2112byte(X8 device) or 1056word(X16 device) data registers are utilized as separate buffers for this operation and the system
design gets more flexible. In addition, for voice or audio applications which use slow cycle time on the order of u-seconds, de-activat-
ing CE during the data-loading and serial access would provide significant savings in power consumption.
K9F1G08Q0M-YCB0,YIB0,PCB0,PIB0 K9F1G16Q0M-YCB0,YIB0,PCB0,PIB0
K9F1G08U0M-YCB0,YIB0,PCB0,PIB0 K9F1G16U0M-YCB0,YIB0,PCB0,PIB0
K9F1G08U0M-VCB0,VIB0,FCB0,FIB0
Figure 4. Program Operation with CE don’ t-care.
CLE
CE
WE
ALE
Figure 5. Read Operation with CE don’ t-care.
CE
WE
I/Ox
CLE
ALE
R/B
CE
WE
RE
I/Ox
t
CS
00h
80h
Address(4Cycles)
Address(4Cycle)
t
WP
t
CH
30h
Data Input
t
R
16
I/O
CE
RE
0
~
7
CE don’ t-care
t
Data Output(serial access)
CEA
t
REA
CE don’ t-care
FLASH MEMORY
Data Input
out
SAMSUNG
10h
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