HCS14D Intersil Corporation, HCS14D Datasheet

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HCS14D

Manufacturer Part Number
HCS14D
Description
Radiation Hardened HEX Inverting Schmitt Trigger
Manufacturer
Intersil Corporation
Datasheet
August 1995
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
Features
• 3 Micron Radiation Hardened SOS CMOS
• Total Dose 200K RAD(Si)
• SEP Effective LET No Upsets: >100 MEV-cm
• Single Event Upset (SEU) Immunity < 2 x 10
• Dose Rate Survivability: >1 x 10
• Dose Rate Upset >10
• Latch-Up Free Under Any Conditions
• Military Temperature Range: -55
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range: 4.5V to 5.5V
• Input Logic Levels
• Input Current Levels Ii
Description
The Intersil HCS14MS is a Radiation Hardened HEX Inverting
Schmitt trigger. A high on any input forces the output to a Low
state.
The HCS14MS utilizes advanced CMOS/SOS technology to
achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family.
The HCS14MS is supplied in a 14 lead Ceramic flatpack Package
(K suffix) or a 14 lead SBDIP Package (D suffix).
Ordering Information
HCS14DMSR
HCS14KMSR
HCS14D/
Sample
HCS14K/
Sample
HCS14HMSR
(Typ)
- VIL = 30% of VCC Max
- VIH = 70% of VCC Min
NUMBER
PART
TEMPERATURE
-55
-55
o
o
RANGE
C to +125
C to +125
+25
+25
+25
10
o
o
o
C
C
C
RAD (Si)/s 20ns Pulse
5 A at VOL, VOH
o
o
C
C
Intersil Class
S Equivalent
Intersil Class
S Equivalent
Sample
Sample
Die
SCREENING
12
o
LEVEL
C to +125
Rads (Si)/s
o
-9
C
14 Lead SBDIP
14 Lead Ceramic
Flatpack
14 Lead SBDIP
14 Lead Ceramic
Flatpack
Die
2
/mg
Errors/Bit-Day
PACKAGE
1
Pinouts
Functional Diagram
GND
A1
A2
A3
Y1
Y2
Y3
An
HCS14MS
HEX Inverting Schmitt Trigger
NOTE: L = Logic Level Low,
FLATPACK PACKAGE (FLATPACK)
14 LEAD CERAMIC DUAL-IN-LINE
14 LEAD CERAMIC METAL SEAL
METAL SEAL PACKAGE (SBDIP)
GND
INPUTS
H = Logic level High
MIL-STD-1835 CDFP3-F14
A1
Y1
A2
Y2
A3
Y3
MIL-STD-1835 CDIP2-T14
An
H
L
1
2
3
4
5
6
7
TRUTH TABLE
1
2
3
4
5
6
7
TOP VIEW
TOP VIEW
Radiation Hardened
Spec Number
14
13
12
11
10
9
8
OUTPUTS
File Number
14
13
12
11
10
9
8
Yn
H
VCC
A6
Y6
A5
Y5
A4
Y4
L
518752
3049.1
Yn
VCC
A6
Y6
A5
Y5
A4
Y4

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HCS14D Summary of contents

Page 1

... HCS14DMSR - +125 C Intersil Class S Equivalent o o HCS14KMSR - +125 C Intersil Class S Equivalent o HCS14D/ +25 C Sample Sample o HCS14K/ +25 C Sample Sample o HCS14HMSR +25 C Die CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 ...

Page 2

Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage ...

Page 3

TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Input to Output TPHL VCC = 4.5V Input to Output TPLH VCC = 4.5V NOTES: 1. All voltages referenced to device GND measurements assume RL = 500 , CL = ...

Page 4

TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETERS SYMBOL Input Switch Points VT+ VT- VH NOTES: 1. All voltages referenced to device GND measurements assume RL = 500 , CL = 50pF, Input ...

Page 5

TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OPEN GROUND STATIC BURN-IN I TEST CONDITIONS (Note 10 11, 13 STATIC BURN-IN II TEST CONNECTIONS (Note ...

Page 6

Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...

Page 7

... All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use ...

Page 8

Die Characteristics DIE DIMENSIONS mils 2,20 x 2.24mm METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND ...

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