TZA3044B Philips Semiconductors, TZA3044B Datasheet
TZA3044B
Related parts for TZA3044B
TZA3044B Summary of contents
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... DATA SHEET TZA3044; TZA3044B SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers Product specification Supersedes data of 1999 Mar 16 File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 1999 Nov 03 ...
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... The data and level detection status outputs are differential outputs for optimum noise margin and ease of use. The TZA3044B has the same functionality as the TZA3044, but with TTL compatible status outputs (pins ST and STQ), and TTL compatible JAM input. ...
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... CF Fig.1 Block diagram. handbook, halfpage 16 RSET 15 V ref 14 V CCD 13 DOUT 12 DOUTQ 11 DGND STQ Fig.3 3 Product specification TZA3044; TZA3044B TZA3044 (24) 13 DOUT A2 A3 (23) 12 DOUTQ (16) 8 JAM (18 (17) 9 STQ (19, 20, 22, 25) (27, 28 DGND V CCD MGR240 SUB ...
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... HIGH; complementary to pin ST O PECL-compatible status output of the input signal level detector (TTL compatible for the TZA3044B); when the input signal is below the user-programmed threshold level, this output is LOW; complementary to pin STQ S digital ground; must be at the same potential as pin AGND O PECL-compatible differential output ...
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... An input signal level detection is implemented to check if the input signal is above the user-programmed level. The outcome of this test is available at the PECL outputs ST and STQ (TTL for the TZA3044B). This flag can also be used to prevent the PECL outputs DOUT and DOUTQ from reacting to noise in the absence of a valid input signal, by connecting pin STQ to pin JAM ...
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... Output circuits The output circuit of ST and STQ is given in Fig.7. The output circuit of DOUT and DOUTQ is given in Fig.8. Some PECL termination schemes are given in Fig.9. 6 Product specification TZA3044; TZA3044B of the TSSOP package is higher than the thermal amb – ...
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... Output signal on pin DOUTQ or pin STQ; complementary to output signal (1) handbook, halfpage 1999 Nov 03 (1) (2) Fig.4 Logic level symbol definitions for PECL DIN 4 Fig.5 Data input circuit DIN and DINQ. 7 Product specification TZA3044; TZA3044B OH(max) V OH(min) V OL(max) V OL(min) GND MGS812 DINQ 4.5 k MGR958 ...
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... 1.5 V RSET CCA handbook, full pagewidth V LOW Output STQ is complementary to output ST. Fig.7 Output circuit ST and STQ for the TZA3044 (left) and TZA3044B (right). handbook, halfpage 1999 Nov 03 V CCA R ADJ RSET V RSET TZA3044 I RSET Fig.6 Level detect input circuit RSET. ...
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... Nov 3 127 82.5 GND 5 83 125 GND Fig.9 PECL output termination schemes. 9 Product specification TZA3044; TZA3044B MGR248 R1 = 127 R2 = 82.5 MGR249 125 MGR250 ...
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... Note 1. For the TZA3044B the minimum value is 0.5 V for ST and STQ outputs. HANDLING This device is ESD sensitive and should be handled with care. Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can ...
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... V CCA V = 1.25 Gbits/s PRBS sequence; note 5 electrically measured note 5 note 8 note 8 20% to 80%; note 5 80% to 20%; note 5 note 5 note 9 11 Product specification TZA3044; TZA3044B MIN. TYP. MAX. 3 3.3 5 110 300 40 +125 40 +25 +85 0.002 1 ...
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... SYMBOL PARAMETER PECL output pins ST and STQ (TZA3044) V LOW-level output voltage OL V HIGH-level output voltage OH C load capacitance L TTL output pins ST and STQ (TZA3044B) V LOW-level output voltage OL V HIGH-level output voltage OH PECL input pin JAM (TZA3044) V LOW-level input voltage IL V HIGH-level input voltage ...
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... V o(dif) (V) (1) (2) 80 120 o(dif) Fig.11 Differential output voltage as function of MGR961 handbook, halfpage (ps i(dif)(p-p) (V) Fig.13 Differential output rise time and fall time as 13 Product specification TZA3044; TZA3044B 1.40 1.36 1.32 1.28 1.24 1.20 1. DOUT DOUTQ junction temperature. 260 t 220 ...
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... MGR965 6 handbook, halfpage hys (dB 120 ( pattern. 7 (2) 2 Fig.17 Status detect hysteresis as function of 14 Product specification TZA3044; TZA3044B RSET ( DIN DINQ 7 1 PRBS pattern (pin ST = HIGH PRBS pattern (pin ST = LOW). (1) (2) 5 ...
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... V RSET (V) 1.545 1.535 1.525 i(dif)(p-p) (V) V RSET ( function of PWD Fig. Product specification TZA3044; TZA3044B (1) ( RSET where V = input low threshold (pin ST = LOW). = ------------- - i(dif dif 7 1 PRBS pattern. Fig.19 Status detect ratio as function of I ...
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... Gbits/s Gigabit Ethernet postamplifiers handbook, full pagewidth 200 mV/div Fig.22 Differential output waveform with 4 mV differential input voltage. handbook, full pagewidth 200 mV/div Fig.23 Differential output waveform with 2 V differential input voltage. 1999 Nov 03 TZA3044; TZA3044B MGR956 MGR957 16 Product specification ...
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... TZA3044 (1, 14) (16) (17) (18) (19, 20, 22, 25 AGND SUB JAM STQ ST Fig.24 Application diagram. 17 Product specification TZA3044; TZA3044B 100 nF V CCD 14 DOUT (24) 13 data out DOUTQ (23 DGND level detect status MGR251 ...
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Acrobat reader. white to force landscape pages to be ... ( DREF OUTQ 1 7 TZA3043T ...
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Acrobat reader. white to force landscape pages to be ... ( DREF OUTQ 1 7 TZA3023T 8 pF OUT IPhoto 3 ...
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... Product specification TZA3044; TZA3044B ...
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... SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers handbook, full pagewidth (1) 1.55 mm (1) Typical value. Fig.27 Bonding pad locations of TZA3044U and TZA3044BU. Physical characteristics of bare die PARAMETER Glass passivation 2.1 m PSG (PhosphoSilicate Glass) on top of 0.65 m oxynitride Bonding pad dimension minimum dimension of exposed metallization is 90 Metallization 1 ...
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... Nov 2.5 scale (1) ( 0.49 0.25 10.0 4.0 1.27 0.36 0.19 9.8 3.8 0.019 0.0100 0.39 0.16 0.050 0.014 0.0075 0.38 0.15 REFERENCES JEDEC EIAJ MS-012AC 22 TZA3044; TZA3044B detail 6.2 1.0 0.7 1.05 0.25 0.25 5.8 0.4 0.6 0.244 0.039 0.028 0.041 0.01 0.01 0.228 ...
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... Nov 2.5 scale (1) ( 0.30 0.2 5.1 4.5 6.6 0.65 0.19 0.1 4.9 4.3 6.2 REFERENCES JEDEC EIAJ MO-153 23 Product specification TZA3044; TZA3044B detail 0.75 0.4 1.0 0.2 0.13 0.50 0.3 EUROPEAN PROJECTION SOT403 ( 0.40 8 ...
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... If wave soldering is used the following conditions must be observed for optimal results: 1999 Nov 03 TZA3044; TZA3044B Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e): – ...
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... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Nov 03 SOLDERING METHOD WAVE not suitable (2) suitable (3)(4) not recommended (5) not recommended 25 Product specification TZA3044; TZA3044B (1) REFLOW suitable suitable suitable suitable suitable ...
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... Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of the die the responsibility of the customer to test and qualify their application in which the die is used. 1999 Nov 03 TZA3044; TZA3044B 26 Product specification ...
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... Philips Semiconductors SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers 1999 Nov 03 TZA3044; TZA3044B NOTES 27 Product specification ...
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... Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel ...