TZA3031U Philips Semiconductors, TZA3031U Datasheet

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TZA3031U

Manufacturer Part Number
TZA3031U
Description
SDH/SONET STM1/OC3 laser drivers
Manufacturer
Philips Semiconductors
Datasheet
Preliminary specification
Supersedes data of 1998 Jul 29
File under Integrated Circuits, IC19
DATA SHEET
TZA3031AHL; TZA3031BHL;
TZA3031U
SDH/SONET STM1/OC3 laser
drivers
INTEGRATED CIRCUITS
1999 Aug 24

Related parts for TZA3031U

TZA3031U Summary of contents

Page 1

... DATA SHEET TZA3031AHL; TZA3031BHL; TZA3031U SDH/SONET STM1/OC3 laser drivers Preliminary specification Supersedes data of 1998 Jul 29 File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 1999 Aug 24 ...

Page 2

... Converter (DAC). The TZA3031BHL is provided with an additional RF data input to facilitate remote (loop mode) system testing. The TZA3031U is a bare die version for use in compact laser module designs. The die contains 40 pads and features the combined functionality of the TZA3031AHL and the TZA3031BHL. ...

Page 3

... CURRENT MUX 19 SWITCH 20 BAND GAP REFERENCE TZA3031BHL 18 CC(R) V CC(G) V CC(B) ALS GND Fig.2 Block diagram of TZA3031BHL. 3 Preliminary specification TZA3031AHL; TZA3031BHL; TZA3031U ALARMHI 18 2 MONIN 22 ONE 23 ZERO LAQ 15 BIAS 6 BGAP 11, 14, 16, 17 24, 25 MBK844 2 MONIN ...

Page 4

... ONE reference level input 23 29 optical ZERO reference level input 24 30 ground 25 31 ground 32 alarm output 26 33 loop mode enable input 27 34 supply voltage (red domain) 4 Preliminary specification TZA3031AHL; TZA3031BHL; TZA3031U DESCRIPTION ...

Page 5

... GND GND 4 TZA3031AHL GND 8 Fig.3 Pin configuration of TZA3031AHL. 5 Preliminary specification TZA3031AHL; TZA3031BHL; TZA3031U DESCRIPTION GND 24 23 ZERO 22 ONE ALARMLO CC(R) V CC( ALARMHI 17 GND MBK846 ...

Page 6

... TONE TZERO BGAP V CC(G) FUNCTIONAL DESCRIPTION The TZA3031AHL, TZA3031BHL and TZA3031U laser drivers accept a 155 Mbits/s STM1 Non-Return to Zero (NRZ) input data stream and generate an output signal with sufficient current to drive a solid state Fabry Perot (FP) or Distributed FeedBack (DFB) laser. They also contain dual loop control circuitry for stabilizing the true laser optical power levels representing logic 1 and logic 0 ...

Page 7

... TONE LASER ------------------------- - 2 ONE LASER = ------------------------------------------------------------------------------------------------ - – TONE – --------------------- - TZERO LASER --------------------------- - 2 ZERO LASER = --------------------------------------------------------------------------------------------------- - – TZERO (dimensionless) in the above formulae is LASER is the electro-optical efficiency which accounts for TZA3031U 3 s (5) ( (7) ( ...

Page 8

... ALARMHI or ALARMLO and V calculated using the following formulae Preliminary specification TZA3031AHL; TZA3031BHL; and ONE . The resistor values can be CC(R) 1.5 1500 = --------------------------- - ALARMHI I BIAS(max) 1.5 300 = ----------------------- - ALARMLO I BIAS(min) TZA3031U , respectively. ZERO (9) (10) ...

Page 9

... Layout recommendations Layout recommendations for the TZA3031AHL and TZA3031BHL can be found in application note “AN98090 , V CC(B) CC(G) Fiber optic transceiverboard STM1/4/8, OC3,12,24, FC/GE” Preliminary specification TZA3031AHL; TZA3031BHL; TZA3031U and the laser CC( recommended to provide the CC(B) domains, the bare die CC . CC(B) ...

Page 10

... THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to solder point th(j-s) R thermal resistance from junction to case th(j-c) 1999 Aug 24 CONDITIONS TZA3031AHL TZA3031AHL TZA3031BHL TZA3031BHL TZA3031AHL TZA3031AHL TZA3031BHL TZA3031BHL PARAMETER 10 Preliminary specification TZA3031AHL; TZA3031BHL; TZA3031U MIN. MAX. 0 0 0.5 CC 0.5 +3.2 0 0 0 ...

Page 11

... A 4.8 OH 1.5 laser optical ‘0’ 24 laser optical ‘1’ note 4 6 referenced to V 1.55 CC(R) note 4 6 referenced to V 1.55 CC(R) floating output 1.4 note 5 floating output 1.4 11 Preliminary specification TZA3031U TYP. MAX. UNIT 5 5. 430 810 mW 250 800 mV + 0.25 V CC( 1.5 ...

Page 12

... CC( 1.55 1.5 CC( mA. BIAS = 60 mA and mA. MOD BIAS = 30 mA and LAQ = 60 mA and MOD LA LAQ TZA3031U MAX. UNIT mUI 1. 1. and BIAS = 90 mA and BIAS CC ...

Page 13

... Section “Bias alarm for TZA3031AHL” for detailed information. The corresponding range of low-bias thresholds is between 1.8 and 19.5 mA. The high-bias threshold range is from 9 to 97.5 mA. handbook, full pagewidth 1999 Aug 24 V I(max I(min) Fig.5 Logic level symbol definitions for data inputs. 13 Preliminary specification TZA3031AHL; TZA3031BHL; TZA3031U and pins ALARMLO or ALARMHI; CC(R) V CC(R) V i(p-p) MGK274 ...

Page 14

... V CC(B) V CC(R) ALS DINQ 10 19, 20 27, 30 TZA3031AHL 11, 14, 16, 17, 24, 25 GND BIAS LA LAQ MPD 14 Preliminary specification TZA3031AHL; TZA3031BHL; DIN ALARM (4) ( ZERO 23 ONE 22 ALARMLO 21 ALARMHI 18 (6) Z1 C11 laser TZA3031U (5) (5) R4 MBK848 ...

Page 15

... TZA3031BHL 11, 14, 16, 17, 6 24, 25 GND BIAS MPD 15 Preliminary specification TZA3031AHL; TZA3031BHL; TZA3031U DIN ENL (4) ( ZERO 23 ONE 22 DLOOPQ 20 loop mode inputs (CML/PECL DLOOP 19 compatible) LAQ (5) Z1 C11 MBK847 ...

Page 16

... Fig.8). TZA3031U (1) Y +910 +910 +910 +910 +910 +910 +910 +910 +681 +541 +384 +227 +70 70 227 367 551 664 ...

Page 17

... TZA3031U Fig.8 Bonding pad locations of TZA3031U. 2 2.000 mm (4.000 Preliminary specification TZA3031AHL; TZA3031BHL; TZA3031U 22 21 GND 20 GND 19 BIAS 18 GND ( LAQ 15 GND 14 V CC( CC(B) ...

Page 18

... 2.5 scale (1) ( 0.27 0.18 5.1 5.1 7.15 0.5 0.17 0.12 4.9 4.9 6.85 REFERENCES JEDEC EIAJ 18 Preliminary specification TZA3031AHL; TZA3031BHL detail 7.15 0.75 1.0 0.2 0.12 0.1 6.85 0.45 EUROPEAN PROJECTION TZA3031U SOT401 (1) ( 0.95 0. 0.55 0.55 0 ISSUE DATE 95-12-19 97-08-04 ...

Page 19

... Use a low voltage ( less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds 300 C. When using a dedicated tool, all other leads can be soldered in one operation within seconds between 270 and 320 C. 19 Preliminary specification TZA3031U ...

Page 20

... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Aug 24 TZA3031AHL; TZA3031BHL; SOLDERING METHOD WAVE not suitable (2) suitable (3)(4) not recommended (5) not recommended 20 Preliminary specification TZA3031U (1) REFLOW suitable suitable suitable suitable suitable ...

Page 21

... Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of the die the responsibility of the customer to test and qualify their application in which the die is used. 1999 Aug 24 TZA3031AHL; TZA3031BHL; 21 Preliminary specification TZA3031U ...

Page 22

... Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel ...

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