TZA3001BHL Philips Semiconductors, TZA3001BHL Datasheet
TZA3001BHL
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TZA3001BHL Summary of contents
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... DATA SHEET TZA3001AHL; TZA3001BHL; TZA3001U SDH/SONET STM4/OC12 laser drivers Preliminary specification Supersedes data of 1997 Sep 08 File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 1999 Aug 24 ...
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... Digital-to-Analog Converter (DAC). The TZA3001BHL is provided with an additional RF data input to facilitate remote (loop mode) system testing. The TZA3001U is a bare die version for use in compact laser module designs. The die contains 40 pads and features the combined functionality of the TZA3001AHL and the TZA3001BHL ...
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... CONTROL BLOCK 28 29 CURRENT MUX 19 SWITCH 20 BAND GAP REFERENCE TZA3001BHL 18 CC(R) V CC(G) V CC(B) ALS GND Fig.2 Block diagram of TZA3001BHL. 3 Preliminary specification TZA3001AHL; TZA3001BHL; TZA3001U ALARMHI 18 2 MONIN 22 ONE 23 ZERO LAQ 15 BIAS 6 BGAP 11, 14, 16, 17 24, 25, 32 ...
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... ONE reference level input 23 29 optical ZERO reference level input 24 30 ground 25 31 ground 32 alarm output 26 33 loop mode enable input 27 34 supply voltage (red domain) 4 Preliminary specification TZA3001AHL; TZA3001BHL; TZA3001U DESCRIPTION ...
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... GND 2 GND 3 4 TZA3001AHL GND 8 Fig.3 Pin configuration of TZA3001AHL. 5 Preliminary specification TZA3001AHL; TZA3001BHL; TZA3001U DESCRIPTION 24 GND 23 ZERO 22 ONE ALARMLO 21 V CC( CC(R) ALARMHI 18 17 GND MGK273 ...
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... TONE TZERO BGAP V CC(G) FUNCTIONAL DESCRIPTION The TZA3001AHL, TZA3001BHL and TZA3001U laser drivers accept a 622 Mbits/s STM4 Non-Return to Zero (NRZ) input data stream and generate an output signal with sufficient current to drive a solid state Fabry Perot (FP) or Distributed FeedBack (DFB) laser. They also contain dual loop control circuitry for stabilizing the true laser optical power levels representing logic 1 and logic 0 ...
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... It is the amount of the extra optical output power in W/A of modulation current optical output power the monitor photodiode responsivity the amount of the extra monitor photodiode current in A/W optical output power. 7 Preliminary specification TZA3001AHL; TZA3001BHL – ...
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... Like the reference currents for the laser current control loop, the alarm reference currents can be set using external resistors connected between pins ALARMHI or ALARMLO and V calculated using the following formulae Preliminary specification TZA3001AHL; TZA3001BHL; and ONE . The resistor values can be CC(R) 1.5 1500 = --------------------------- - ALARMHI ...
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... It should be noted that the optical receiver used in conjunction with the TZA3001BHL must have a loop mode output in order to complete the test loop. A HIGH-level on pin ENL selects the loop mode. By default pin ENL is pulled at LOW-level pull-down resistor ...
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... T junction temperature j T storage temperature stg THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to solder point th(j-s) R thermal resistance from junction to case th(j-c) 1999 Aug 24 TZA3001AHL; TZA3001BHL; CONDITIONS TZA3001AHL TZA3001AHL TZA3001BHL TZA3001BHL TZA3001AHL TZA3001AHL TZA3001BHL TZA3001BHL PARAMETER 10 Preliminary specification TZA3001U MIN. MAX. ...
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... SYMBOL PARAMETER Supply V supply voltage CC I supply current CC P total power dissipation tot Data inputs: pins DIN and DINQ (and pins DLOOP and DLOOPQ on TZA3001BHL); see Fig.5 V input voltage i(p-p) (peak-to-peak value) V input offset voltage IO V minimum input voltage I(min) V maximum input voltage ...
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... V higher alarm; note 12 6 referenced and I MOD refers to, but does not include the on-chip dissipation with I MOD is the on-chip dissipation with I tot 12 Preliminary specification TZA3001AHL; TZA3001BHL; MIN. TYP 120 300 120 300 50 2 ...
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... Section “Bias alarm for TZA3001AHL” for detailed information. The corresponding range of low-bias thresholds is between 1.8 and 19.5 mA. The high-bias threshold range is from 9 to 97.5 mA. handbook, full pagewidth 1999 Aug 24 V I(max I(min) Fig.5 Logic level symbol definitions for data inputs. 13 Preliminary specification TZA3001AHL; TZA3001BHL; TZA3001U and pins ALARMLO or ALARMHI; CC(R) V CC(R) V i(p-p) MGK274 ...
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... V CC(B) V CC(R) ALS DINQ 10 19, 20 27, 30 TZA3001AHL 11, 14, 16, 17, 24, 25 GND BIAS LA LAQ MPD 14 Preliminary specification TZA3001AHL; TZA3001BHL; DIN ALARM (4) ( ZERO 23 ONE 22 ALARMLO 21 ALARMHI 18 (6) Z1 C11 laser TZA3001U (5) (5) R4 MGK276 ...
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... R1 and R2 are used for optical ZERO and ONE reference currents setting (see Section “Automatic laser control”). ( required for balancing the output stage (see Section “Power supply connections”). Fig.7 Application diagram showing the TZA3001BHL configured for 622 Mbits/s (STM4/OC12). 1999 Aug 24 ...
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... V CC(R) 350 DIN 210 DINQ 70 V CC(R) +70 ALS +210 GND +350 GND +490 Note +630 1. All x and y coordinates represent the position of the +910 +910 16 Preliminary specification TZA3001AHL; TZA3001BHL; COORDINATES SYMBOL PAD X 23 +384 24 +227 25 + 210 28 367 29 524 30 681 31 910 32 ...
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... TZA3001U Fig.8 Bonding pad locations of TZA3001U. 2 2.000 mm (4.000 Preliminary specification TZA3001AHL; TZA3001BHL; TZA3001U GND 19 GND 18 BIAS 17 GND LAQ GND 14 V CC( CC( GND 9 10 MGL192 ...
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... 2.5 scale (1) ( 0.27 0.18 5.1 5.1 7.15 0.5 0.17 0.12 4.9 4.9 6.85 REFERENCES JEDEC EIAJ 18 Preliminary specification TZA3001AHL; TZA3001BHL detail 7.15 0.75 1.0 0.2 0.12 0.1 6.85 0.45 EUROPEAN PROJECTION TZA3001U SOT401 (1) ( ...
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... To overcome these problems the double-wave soldering method was specifically developed. 1999 Aug 24 TZA3001AHL; TZA3001BHL; If wave soldering is used the following conditions must be observed for optimal results: Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave ...
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... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Aug 24 TZA3001AHL; TZA3001BHL; SOLDERING METHOD WAVE not suitable ...
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... Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of the die the responsibility of the customer to test and qualify their application in which the die is used. 1999 Aug 24 TZA3001AHL; TZA3001BHL; 21 Preliminary specification TZA3001U ...
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... Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel ...