93LC86-SN Microchip Technology, 93LC86-SN Datasheet - Page 3

• Manufacturer Part Number: 93LC86-SN
• Description: 8K/16K 2.5V Microwire Serial EEPROM
• Manufacturer: Microchip Technology

Lucent Technologies Inc.
April 1999
Pinout Information
Table 1. Pinout Descriptions
Handling Precautions
Note: Dimensions are inches and (millimeters).
Power Sequencing
Adopt the following sequence for turn-on as a matter of
good practice to avoid the possibility of damage to the
pump laser module from power supply switching tran-
sients:
1. All ground connections
2. Most negative supply
3. Most positive supply
4. All remaining connections
Reverse the order for the proper turn-off sequence.
0.140
(3.56)
0.062 (1.58)
Pin
0.031 (0.79)
10
11
12
13
14
1
2
3
4
5
6
7
8
9
Figure 2. Fillister Head Screw
Photodetector Cathode
0.041 (1.04)
Pump Laser Cathode
Photodetector Anode
Pump Laser Anode
(continued)
Chassis Ground
Chassis Ground
Chassis Ground
Chassis Ground
Chassis Ground
Chassis Ground
Chassis Ground
Chassis Ground
Chassis Ground
Chassis Ground
0.118
(3.00)
Connection
0.129 (3.28)
0.086
(2.18)
1-532(F)
Mounting Instructions
The minimum fiber-bend radius is 25 mm.
To avoid degradation in performance, mount the mod-
ule on the board as follows (see Figure 2):
1. Place the bottom flange of the module on a flat heat
Mount four #2-56 screws with Fillister heads (M2-
3 mm) at the four screw hole locations (see Outline
Diagram). The Fillister head diameter must not exceed
0.140 in. (3.55 mm). Do not apply more than 2 in./lb. of
torque to the screws. To minimize package distortion, it
is recommended that a washer is used above and
beneath each mounting foot.
Electrostatic Discharge
Caution: This is a Class 0 ESD device which is
Lucent employs a human-body model (HBM) and the
field-induced charged-device model (CDM) for ESD-
susceptibility testing and protection design evaluation.
ESD voltage thresholds are dependent on the critical
parameters used to define the model. A standard HBM
(resistance = 1.5 k , capacitance = 100 pF) is widely
used and, therefore, can be used for comparison pur-
poses. The HBM ESD threshhold presented here was
obtained using these circuit parameters:
Charged-device Model
Human-body Model
sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in
size. The surface finish of the heat sink should be
better than 32 µin. (0.8 µm), and the surface flatness
must be better than 0.001 in. (25.4 µm).
Parameter
susceptible to damage as a result of
electrostatic discharge (ESD). Take
proper precautions during both handling
and testing. Follow JEDEC Publication
No. 108-A (Dec. 1998).
Reliability Pump Laser Module
Value
200
400
Unit
V
V
3