ISD4004-08MX Winbond, ISD4004-08MX Datasheet - Page 25

• Manufacturer Part Number: ISD4004-08MX
• Description: Single-Chip Voice Record/Playback Devices 8-/ 10-/ 12-/ and 16-Minute Durations
• Manufacturer: Winbond

1.
2.
3.
ISD
The backside of die is internally connected to V
may occur.
Double bond recommended.
This figure reflects the current die thickness. Please contact ISD as this thickness may change in the future.
ISD4004 Series
I.
II.
III. Pad Opening (min)
Die Dimensions
X: 4230 microns
Y: 9780 microns
Die Thickness
11.5 ±0.5 mils
90 x 90 microns
3.5 x 3.5 mils
Figure 15: ISD4004 Series Bonding Physical Layout
(3)
SS
. It MUST NOT be connected to any other potential or damage
V
SSD1
V
SSD2
V
SSA
(2)
V
SSA
MISO
MOSI
AUD OUT
1
SCLK
SS
ISD4004
(Unpackaged Die)
AM CAP
V
CCD1
V
CCD2
XCLK
ANA IN–
INT
ANA IN+
RAC
V
CCA
(2)
V
SSA
21