ADG658 Analog Devices, ADG658 Datasheet - Page 5

• Manufacturer Part Number: ADG658
• Description: +3 V/+5 V/5 V CMOS 4-/8-Channel Analog Multiplexers
• Manufacturer: Analog Devices

ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
Analog Inputs
Digital Inputs
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . 40 mA
Continuous Current, S or D . . . . . . . . . . . . . . . . . 20 mA
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . –65°C to +150°C
Junction Temperature
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily ac cu mu late
on the human body and test equipment and can discharge without detection. Although the ADG658/
ADG659 feature proprietary ESD pro tec tion circuitry, permanent damage may occur on devices subjected
to high energy electrostatic discharges. Therefore, proper ESD pre cau tions are rec om mend ed to avoid
per for mance deg ra da tion or loss of functionality.
Model
ADG658YRU
ADG658YCP
ADG659YRU
ADG659YCP
A2
X
0
0
0
0
1
1
1
1
X = Don’t Care
A1
X
0
0
1
1
X = Don’t Care
REV. 0
DD
DD
SS
A
Automotive (Y Version) . . . . . . . . . . . . –40°C to +125°C
Industrial (B Version) . . . . . . . . . . . . . . –40°C to +85°C
= 25°C, unless otherwise noted.)
to GND . . . . . . . . . . . . . . . . . . . . . . . .+0.3 V to –6.5 V
to V
to GND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +13 V
SS
A1
X
0
0
1
1
0
0
1
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 V
A0
X
0
1
0
1
2
2
Table II. ADG659 Truth Table
. . . . . . . . . . . . . . V
. . . . . . . . . . . . GND – 0.3 V to V
Table I. ADG658 Truth Table
A0
X
0
1
0
1
0
1
0
1
Temperature Range
–40°C to +125°C
–40°C to +85°C
–40°C to +125°C
–40°C to +85°C
(Pulsed at 1 ms, 10% duty cycle max)
. . . . . . . . . . . . . . . . . . . . . . . 150°C
1
0
0
0
0
0
0
0
0
1
0
0
0
0
or 10 mA, whichever occurs fi rst
Switch Condition
NONE
1
2
3
4
5
6
7
8
SS
1
– 0.3 V to V
On Switch Pair
NONE
1
2
3
4
DD
DD
Package Description
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
–5–
Lead Temperature, Soldering
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 kV
NOTES
1
2
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of
the device at these or any other conditions above those listed in the operational
sections of this specifi cation is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability. Only one
absolute maximum rating may be applied at any one time.
Overvoltages at A
should be limited to the maximum ratings given.
JA
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
16-Lead LFCSP
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Thermal Impedance, 16-Lead TSSOP . . . . . 150.4°C/W
Thermal Impedance (4-Layer Board),
S8
S6
GND
D
V
S5
S7
S8
S6
SS
1
2
3
4
D
1
2
3
4
5
6
7
8
(Not to Scale)
(Not to Scale)
16 15 14 13
5
ADG658
X ,
TOP VIEW
TOP VIEW
ADG658
6
PIN CONFIGURATIONS
7
, S, or D will be clamped by internal diodes. Current
8
. . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
16
15
14
13
12
11
10
9
12
11
10
9
V
S3
S2
S1
S4
A0
A1
A2
DD
TSSOP
S2
S1
S4
A0
LFCSP
S4B
S2B
ADG658/ADG659
DB
GND
S1B
S3B
S4B
S2B
V
DB
SS
1
2
3
4
1
2
3
4
5
6
7
8
(Not to Scale)
(Not to Scale)
16 15 14 13
5
ADG659
TOP VIEW
TOP VIEW
ADG659
Package Option
RU-16
CP-16
RU-16
CP-16
6
7
8
16
15
14
13
12
11
10
9
12
11
10
9
V
S3A
S2A
DA
S1A
S4A
A0
A1
DD
S2A
DA
S1A
S4A