ADG619 Analog Devices, ADG619 Datasheet - Page 4

• Manufacturer Part Number: ADG619
• Description: CMOS +-5 V/ +5V 4 OHM SINGLE SPDT SWITCHES
• Manufacturer: Analog Devices

CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG619/ADG620 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
ADG619/ADG620
ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
Analog Inputs
Digital Inputs
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 50 mA
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Micro-SOIC Package
SOT-23 Package
Lead Temperature, Soldering (10 seconds) . . . . . . . . . 300°C
IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1
2
Model
ADG619BRM
ADG619BRT
ADG620BRM
ADG620BRT
*Branding on SOT-23 and Micro-SOIC packages is limited to three characters due to space constraints.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
limited to the maximum ratings given.
DD
DD
SS
A
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +85°C
JA
JC
JA
JC
= 25°C unless otherwise noted)
to GND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V
to V
to GND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . 229.6°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . 91.99°C/W
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
2
2
. . . . . . . . . . . . . . . . V
. . . . . . . . . . . . . . . . . –0.3 V to V
(Pulsed at 1 ms, 10% Duty Cycle max)
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
30 mA, Whichever Occurs First
1
SS
–0.3 V to V
DD
DD
Branding
Information
SVB
SVB
SWB
SWB
+0.3 V or
ORDERING GUIDE
+0.3 V
–4–
*
Package Description
Micro-SOIC (microSmall Outline IC)
SOT-23 (Plastic Surface Mount)
Micro-SOIC (microSmall Outline IC)
SOT-23 (Plastic Surface Mount)
PIN CONFIGURATIONS
GND
GND
V
V
8-Lead Micro-SOIC
S1
DD
S1
DD
D
D
8-Lead SOT-23
NC = NO CONNECT
NC = NO CONNECT
1
2
3
4
1
2
3
4
(Not to Scale)
(Not to Scale)
ADG619/
ADG619/
ADG620
ADG620
(RM-8)
TOP VIEW
TOP VIEW
(RT-8)
WARNING!
8
7
6
5
8
7
6
5
S2
IN
NC
S2
IN
NC
V
V
SS
SS
ESD SENSITIVE DEVICE
Package Option
RM-8
RT-8
RM-8
RT-8
REV. 0