LX5225CDWP Microsemi Corporation, LX5225CDWP Datasheet - Page 2
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LX5225CDWP
Manufacturer Part Number
LX5225CDWP
Description
ULTRA 18-LINE/ PLUG AND PLAY SCSI TERMINATOR
Manufacturer
Microsemi Corporation
Datasheet
1.LX5225CDWP.pdf
(4 pages)
LX5225
2
Note 2. Range over which the device is functional.
Term Power = 4.75V unless otherwise specified. Unless otherwise specified, these specifications apply at the recommended operating ambient tempera-
ture of T
Termpwr Voltage
Signal Line Voltage
Disconnect Input Voltage
Operating Virtual Junction Temperature Range
Output High Voltage
TermPwr Supply Current
Output Current
Disconnect Input Current
Output Leakage Current
Channel Bandwidth
Termination Sink Current, per Channel
TermPwr Voltage ................................................................................................. +7V
Signal Line Voltage ................................................................................... 0V to +7V
Operating Junction Temperature
Storage Temperature Range .............................................................. -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) .................................................... 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with
DWP PACKAGE:
Junction Temperature Calculation: T
The
system. All of the above assume no ambient airflow.
LX5225C
THERMAL RESISTANCE-JUNCTION TO LEADS,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
Plastic (DWP Packages) ............................................................................... 150°C
JA
A
= 25°C. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.
numbers are guidelines for the thermal performance of the device/pc-board
respect to Ground. Currents are positive into, negative out of the specified
terminal.
Parameter
A B S O L U T E M A X I M U M R AT I N G S
Parameter
R E C O M M E N D E D O P E R AT I N G C O N D I T I O N S
T HE RM AL DATA
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
U
J
LT R A
= T
Symbol
A
V
I
BW
I
SINK
I
OUT
I
I
OUT
+ (P
CC
IN
OL
P
E L E C T R I C A L C H A R A C T E R I S T I C S
18-L
D
R O D U C T I O N
x
JL
All data lines = open
All data lines = 0.2V
DISC1 and DISC2 Pins < 0.8V
V
DISC1 and DISC2 Pins = 0V
DISC1 and DISC2 Pins = < 0.8V, V
V
OUT
OUT
JA
JA
I N E
).
= 0.2V
= 4V
, P
L U G A N D
Test Conditions
(Note 1)
Symbol
D
V
P
TERM
L AY
A T A
18°C/W
40°C/W
O
SCSI T
= 0.2V
S
Recommended Operating Conditions
H E E T
Min.
4.0
0
0
0
E R M I N AT O R
HEAT SINK/GND
HEAT SINK/GND
(Note 2)
Typ.
PACKAGE PIN OUTS
DISC1
GND
V
TERM
T1
T2
T3
T4
T5
T6
T7
T8
T9
2.65
Min.
-20
7
DWP PACKAGE
(Top View)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
LX5225
Typ.
2.85
424
-22
10
50
35
UltraMAX
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Max.
V
125
5.5
TERM
5
Max.
450
150
-24
-10
DISC2
T18
T17
T16
T15
T14
HEAT SINK/GND
HEAT SINK/GND
HEAT SINK/GND
T13
T12
T11
T10
N.C.
15
1
Copyright © 1999
Rev. 1.0
Units
Units
°C
MHz
V
V
V
mA
mA
mA
mA
µA
µA
µA
V
5/99