AD815-EB Analog Devices, AD815-EB Datasheet - Page 3

• Manufacturer Part Number: AD815-EB
• Description: High Output Current Differential Driver
• Manufacturer: Analog Devices

REV. B
Model
AD815ARB-24
AD815ARB-24-REEL
AD815AVR
AD815AY
AD815AYS
AD815-EB
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Power Dissipation
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . .
Output Short Circuit Duration
Storage Temperature Range
Operating Temperature Range
Lead Temperature Range (Soldering, 10 sec) . . . . . . . +300 C
NOTES
1
2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD815 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Specification is for device in free air with 0 ft/min air flow: 15-Lead Through-Hole
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
and Surface Mount:
Plastic (Y and VR) . . 3.05 Watts (Observe Derating Curves)
Small Outline (RB) . . 2.4 Watts (Observe Derating Curves)
Y, VR and RB Package . . . . . . . . . . . . . . . –65 C to +125 C
AD815A . . . . . . . . . . . . . . . . . . . . . . . . . . . –40 C to +85 C
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
24-Lead Thermally-Enhanced SOIC (RB-24)
*HEAT TABS ARE CONNECTED TO THE POSITIVE SUPPLY.
HEAT TABS
THERMAL
JA
+V
PIN CONFIGURATION
OUT1
= 41 C/W; 24-Lead Surface Mount:
S
+IN1
–IN1
*
–V
NC
NC
NC
NC
S
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
Temperature Range
10
11
12
NC = NO CONNECT
1
2
3
4
5
6
7
8
9
2
(Not to Scale)
TOP VIEW
AD815
Can Only Short to Ground
1
24
23
22
20
19
18
17
16
15
14
13
21
NC
NC
NC
NC
+IN2
–IN2
OUT2
+V
S
THERMAL
HEAT TABS
+V
S
*
Package Description
24-Lead Thermally Enhanced SOIC
24-Lead Thermally Enhanced SOIC
15-Lead Surface Mount DDPAK
15-Lead Through-Hole SIP with Staggered Leads and 90 Lead Form
15-Lead Through-Hole SIP with Staggered Leads and Straight Lead Form
Evaluation Board
JA
= 52 C/W.
18 V Total
ORDERING GUIDE
6 V
S
–3–
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD815
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for the plastic encapsulated
parts is determined by the glass transition temperature of the
plastic, about 150 C. Exceeding this limit temporarily may
cause a shift in parametric performance due to a change in the
stresses exerted on the die by the package. Exceeding a junction
temperature of 175 C for an extended period can result in
device failure.
The AD815 has thermal shutdown protection, which guarantees
that the maximum junction temperature of the die remains below a
safe level, even when the output is shorted to ground. Shorting
the output to either power supply will result in device failure.
To ensure proper operation, it is important to observe the
derating curves and refer to the section on power considerations.
It must also be noted that in high (noninverting) gain configurations
(with low values of gain resistor), a high level of input overdrive
can result in a large input error current, which may result in a
significant power dissipation in the input stage. This power
must be included when computing the junction temperature rise
due to total internal power.
Plot of Maximum Power Dissipation vs. Temperature
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
–50
(STILL AIR = 0 FT/MIN)
NO HEAT SINK
–40 –30 –20 –10
JA
= 52 C/W
(STILL AIR = 0FT/MIN)
NO HEAT SINK
JA
= 41 C/W
AMBIENT TEMPERATURE – C
0
10 20 30 40
SOLDERED DOWN TO
COPPER HEAT SINK
(STILL AIR = 0FT/MIN)
JA
AD815ARB-24
AD815 AVR, AY
WARNING!
= 16 C/W
AD815 AVR, AY
50 60
T
J
ESD SENSITIVE DEVICE
= 150 C
70 80
Package Option
RB-24
RB-24
VR-15
Y-15
YS-15
AD815
90