INA-12063-BLK HP [Agilent(Hewlett-Packard)], INA-12063-BLK Datasheet - Page 19

• Manufacturer Part Number: INA-12063-BLK
• Description: 1.5 GHz Low Noise Self-Biased Transistor Amplifier
• Manufacturer: HP [Agilent(Hewlett-Packard)]

• A Note on Supply Line
Bypassing
When multiple bypass capacitors
are used throughout the power
supply lines in a wireless system,
consideration should be given to
potential resonances. It is impor-
tant to ensure that the capacitors,
when combined with additional
parasitic L’s and C’s on the circuit
board, do not form resonant
circuits. The addition of a small
value resistor in the bias supply
line between bypass capacitors
will often “de-Q” the bias circuit
and eliminate resonance effects.
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-363
package, will reach solder reflow
temperatures faster than those
with a greater mass.
Figure 29. Surface Mount Assembly Profile.
250
200
150
100
50
0
0
60
Preheat
Zone
120
TIME (seconds)
The INA-12063 is has been
qualified to the time-temperature
profile shown in Figure 29. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evapo-
rating solvents from the solder
paste. The reflow zone briefly
elevates the temperature suffi-
ciently to produce a reflow of the
solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
exceed 235 C.
These parameters are typical for
a surface mount assembly
process for the INA-12063. As a
general guideline, the circuit
Reflow
Zone
180
Cool Down
Zone
6-134
MAX
) should not
240
T
MAX
300
board and components should be
exposed only to the minimum
temperatures and times neces-
sary to achieve a uniform reflow
of solder.
Statistical Parameters
Several categories of parameters
appear within this data sheet.
Parameters may be described
with values that are either
minimum or maximum, “typical,”
or standard deviations.
The values for parameters are
based on comprehensive product
characterization data, in which
automated measurements are
made on of a minimum of 500
parts taken from 3 non-consecu-
tive process lots of semiconduc-
tor wafers. The data derived from
product characterization tends to
be normally distributed, e.g., fits
the standard bell curve.
Parameters considered to be the
most important to system perfor-
mance are bounded by minimum
or maximum values. For the
INA-12063, these parameters are:
Power Gain (|S
(NF), and Device Current. Each
of these guaranteed parameters is
100% tested.
Values for most of the parameters
in the table of Electrical Specifi-
cations that are described by
typical data are the mathematical
mean ( ), of the normal distribu-
tion taken from the characteriza-
tion data. For parameters where
measurements or mathematical
averaging may not be practical,
such as S-parameters or Noise
Parameters and the performance
curves, the data represents a
nominal part taken from the
center of the characterization
distribution. Typical values are
intended to be used as a basis for
electrical design.
21
|
2
), Noise Figure