AS2533F AMSCO [austriamicrosystems AG], AS2533F Datasheet - Page 23

• Manufacturer Part Number: AS2533F
• Description: Multi-Standard CMOS Telephone IC for Basic Telephones
• Manufacturer: AMSCO [austriamicrosystems AG]

Data Sheet AS2533-36
Mechanical Drawing of Frame
Revision 8.8
Conditions for Delivery as Dice on Foil, sawn
Die thickness
Back finishing
Frame
Frame Position Tolerance
Tape
Sawing conditions
Packing
Storage time In sealed bags
380 ± 20µm
back grinding, silicon
Material: Plastic
Size: see figure
Center wafer to frame: ± 4mm
Angle deviation wafer to frame: ± 8°
Orientation wafer to frame: Wafer flat to frame side with kerfs
Covering adhesive foil to frame: >5mm
Type: PVC with acrylic adhesive
Thickness: 70 ± 20 µm
Sawing mode: Saw - through mode
Sawing width: typ. 60 µm
Kerf depth in foil: typ. 20 µm
XV -dimension deviation: max.25 µm
frame sealed in foil bags filled with nitrogen
2 months, Tamb = 25 °C
austriamicrosystems
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