D2-24044 INTERSIL [Intersil Corporation], D2-24044 Datasheet - Page 20

• Manufacturer Part Number: D2-24044
• Description: Digital Audio Amplifier Power Stage
• Manufacturer: INTERSIL [Intersil Corporation]

Package Outline Drawing
M38.173C
38 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE (HTSSOP)
Rev 0, 4/10
(5.80)
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
(36X 0.50)
B
0.05
A
9.70±0.10
SIDE VIEW
0.50
(4.60)
C
20
3
0.17-0.27
4
2
38
1
4.4±0.10
0.08
(38X 0.28)
PIN 1 ID
0.90±0.05
2X N/2 TIPS
M
4
C
0.05/0.15
(1.30)
(3.20)
0.20
A-B
6.4
D
1.10 MAX
C
D2-24044
D
A-B
5
D
C
NOTES:
SEATING
PLANE
1. Die thickness allowable is 0.279±0.0127 (0.0110±0.0005 inches).
2. Dimensioning & tolerances per ASME. Y14.5m-1994.
3. Datum plane H located at mold parting line and coincident
4. At reference datum and does not include mold flash or protrusions,
5. The lead width dimension does not include dambar protrusion.
6. This part is compliant with JEDEC specification MO-153 variation BDT-1
END VIEW
0.10
with lead where lead exits plastic body at bottom of parting line.
and is measured at the bottom parting line. Mold flash or protrusions
shall not exceed 0.15mm on the package ends and 0.25mm between
the leads.
Allowable dambar protrusion shall be 0.07mm total in excess of
the lead width dimension at maximum material condition. Dambar
cannot be located on the lower radius or the foot. Minimum space
between protrusions and an adjacent lead should be 0.08mm.
C
DETAIL "A"
C L
0.09-0.20
SEE
1 2 3
0.25
(0-8°)
(VIEW ROTATED 90°C.W.)
EXPOSED PAD VIEW
DETAIL "A"
SCALE: 30/1
4.6±0.10
(1.00)
0.6±0.10
(14°) TYP
September 3, 2010
H
PARTING
3
3.20±0.10
FN7678.0
LINE